Chemical mechanical polishing device controlled by computer

Abstract

The computer-controlled chemical mechanical polishing device comprises a base, a hydraulic oil cylinder is fixedly connected to the upper end of the base, a mounting plate is fixedly connected to the movable end of the hydraulic oil cylinder, a polishing pad is fixedly connected to the upper end of the mounting plate, and a U-shaped frame is fixedly connected to the upper end of the base; a motor is fixedly connected to the inner top of the U-shaped frame, a disc is fixedly connected to the output end of the motor, a fixing mechanism is mounted on the disc and comprises a plurality of fixing shafts symmetrically and fixedly connected to the lower end of the disc, fixing blocks are fixedly connected to the lower ends of the fixing shafts, and fixing grooves are formed in the lower ends of the fixing blocks. Two sliding grooves are symmetrically formed in the inner wall of the fixing groove, and two fixing rods are slidably connected to the inner walls of the two sliding grooves. According to the cleaning mechanism, residual polishing liquid and metal pollutants on the surface of a workpiece can be quickly cleaned away, the labor intensity of workers is greatly reduced, and the chemical polishing efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a computer-controlled chemical mechanical polishing device. Background technique [0002] Chemical mechanical polishing, also known as chemical mechanical planarization, is a technology in the manufacturing process of semiconductor devices. It is to rotate the workpiece to be polished relative to a polishing pad under a certain downforce and the presence of polishing fluid. Mechanical grinding and corrosion of chemical oxidants are used to complete the material removal on the surface of the workpiece and obtain a smooth surface. [0003] After the existing computer-controlled chemical mechanical polishing device polishes the workpiece, a large amount of polishing liquid and metal pollutants will remain on the surface of the workpiece, and workers need to clean up the polishing liquid and metal pollutants on the surface of the workpiece later, which is troubl...

AI Technical Summary

Problems solved by technology

[0003] After the existing computer-controlled chemical mechanical polishing device polishes the workpiece, a large amount of polishing liquid and metal pollutants will remain on the surface of the workpiece, and workers need to clean up the polishing liquid and metal pollutants on the surface of the workpiece later, which is troublesome. It is very time-consuming and labor-intensive, which greatly increases the labor intensity of workers. In addition, the existing computer-controlled chemical mechanical polishing device can only polish one workpiece at a time, and the polishing efficiency is relatively low.

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