Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Acid copper plating process suitable for carrier plate electroplating

A technology of acidic copper plating and carrier plate, which is applied in the direction of jewelry, etc., can solve the problems of low internal stress, non-ductility of electroplating layer, and inability to improve the plating distribution of hole copper and surface copper thickness, etc., to achieve stable performance, fine crystallization, easy maintenance effect

Pending Publication Date: 2022-05-10
江西博泉化学有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the traditional electroplating solution cannot improve the electroplating distribution of hole copper and surface copper thickness, and the electroplating layer does not have good ductility and low internal stress

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0077] Embodiment 2: Carry out cleaning, water washing, acid leaching, electroplating, secondary water washing and drying steps sequentially on the carrier plate that needs to be electroplated. Before acid leaching, micro-etching and water washing after micro-etching can also be performed. This operation is The existing technical content will not be repeated here. In this process, the cathode current density in the electroplating process is 20ASF, and the electroplating solution components include: copper sulfate 250g / L, electroplating grade sulfuric acid 50g / l, analytically pure Hydrochloric acid 80ppm, copper plating leveler 40ml / L, copper plating brightener 1.3ml / l, copper plating wetting agent 15ml / L.

[0078] The plating solution used in this process is configured using the following steps:

[0079] Step S001, add 60% DI water of the tank volume into the storage tank, and add C.P grade concentrated sulfuric acid with a specific gravity of 1.84 and mix thoroughly; the reac...

Embodiment 3

[0108] Embodiment 3: Carry out cleaning, water washing, acid leaching, electroplating, secondary water washing and drying steps sequentially on the carrier plate that needs to be electroplated. Before acid leaching, micro-etching and water washing after micro-etching can also be performed. This operation is Existing technical content, do not repeat too much here, in this process, the cathodic current density in the electroplating process is 14ASF, and electroplating solution composition includes: copper sulfate 230g / L, electroplating grade sulfuric acid 40g / l, analytical pure Hydrochloric acid 60ppm, copper plating leveler 32ml / L, copper plating brightener 0.9ml / l, copper plating wetting agent 10ml / L.

[0109] The plating solution used in this process is configured using the following steps:

[0110] Step S001, add 60% DI water of the tank volume into the storage tank, and add C.P grade concentrated sulfuric acid with a specific gravity of 1.84 and mix thoroughly; the reaction...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of copper plating, and particularly discloses an acidic copper plating process suitable for carrier plate electroplating, which comprises the step of electroplating a carrier plate through an electroplating solution, and is characterized in that the electroplating solution comprises the following components: 200-250g / L of copper sulfate, 30-50g / L of electroplating-grade sulfuric acid, 40-80ppm of analytically pure hydrochloric acid, 25-40ml / L of a copper plating leveling agent, 0.5-1.3 ml / L of a copper plating brightener and 5-15ml / L of a copper plating wetting agent, the device is designed for HDI products filled with blind holes, is suitable for insoluble anodes and soluble anodes, can show excellent filling capacity in vertical continuous electroplating or a traditional portal frame type electroplating line, is stable in electroplating liquid performance, and has an excellent blind hole filling effect; the electroplated copper particles are bright, fine in crystal, good in ductility and excellent in uniformity; a direct-current electroplating method can be used for production; maintenance is easy; a Hou's cell and a CVS can be used for analysis and control.

Description

technical field [0001] The present application relates to the technical field of copper plating, and specifically discloses an acidic copper plating process suitable for carrier plate electroplating. Background technique [0002] In the PCB manufacturing industry, copper electroplating has been used for many years. The copper electroplating solution for printed boards is an acidic solution, which has the characteristics of high acid and low copper. It has excellent dispersion ability and deep plating ability, and the copper layer after plating is glossy. [0003] In the process of printed boards, the copper plating has two functions: one is electroplating copper on the whole board, which protects the thin chemical copper just deposited, prevents the chemical copper from being oxidized and etched by acid, and thickens it to a certain level by electroplating. The thickness is usually 5um ~ 8um. The other is pattern copper plating, which thickens hole copper and line copper to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D5/00C25D7/00C25D3/38
CPCC25D5/00C25D7/00C25D3/38
Inventor 李洪斌舒平
Owner 江西博泉化学有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com