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Etching method of aluminum-based copper-clad plate

An aluminum-based copper-clad laminate and etching technology, which is applied to the removal of conductive materials by chemical/electrolytic methods, secondary treatment of printed circuits, etc., can solve problems such as uneven circuit surfaces and affect the quality of aluminum substrates, and improve manufacturing yield. Effect

Pending Publication Date: 2022-04-29
GUANGDONG HIIC SEMICON LTD
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Problems solved by technology

[0003] The technical problem to be solved in the present invention is to solve the problem that the unevenness of the circuit surface of the existing aluminum substrate affects the quality of the aluminum substrate due to the defects of the etching process

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  • Etching method of aluminum-based copper-clad plate
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  • Etching method of aluminum-based copper-clad plate

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Embodiment Construction

[0037] It should be noted that, under the condition that there is no conflict in structure or function, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below based on examples.

[0038] The invention provides an etching method for an aluminum-based copper-clad laminate. Aluminum-based copper-clad laminates are referred to as aluminum substrates, such as figure 1 As shown, the aluminum substrate includes three layers, the surface is a copper clad layer 101, the main component is pure copper, and its thickness is 2-15 ounces, which is mainly used to make molding circuits; the middle is an insulating layer 102, the main component is epoxy resin or Epoxy glass cloth bonding sheet, its thickness is 50-200um, its main function is insulation, so that the upper and lower metal layers are separated; the bottom surface is aluminum base layer 103, the main component is aluminu...

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Abstract

The invention relates to an etching method of an aluminum-based copper-clad plate, which comprises the following steps of: cutting the aluminum-based copper-clad plate to form a base material plate, etching the base material plate to form a circuit, performing surface treatment on the surface of a copper foil layer subjected to electrical test, and performing plate splitting treatment on the base material plate. Compared with an etching method in the prior art in which the surface of the copper foil layer is treated firstly and then the electrical parameter of the substrate is tested, the etching method provided by the invention avoids the quality problem of subsequent circuit board manufacturing caused by test marks formed on the circuit surface in the prior art, so that the manufacturing yield of the circuit board is improved. Moreover, the two steps are processed by corresponding independent equipment, and the position of the equipment is not required to be adjusted like a working procedure on an assembly line, so that the conveying mode of the materials is not influenced, only the flow file is required to be modified, and the modification of the working procedure does not influence the production efficiency.

Description

technical field [0001] The invention relates to an etching process technology of an aluminum substrate, in particular to an etching method of an aluminum-based copper-clad laminate. Background technique [0002] Aluminum-based copper clad laminates are aluminum substrates, which are made of aluminum plates, epoxy resin or epoxy glass cloth bonding sheets, and copper foils by hot pressing. For some special application environments, such as the electrical connection is realized by bonding wires on the aluminum substrate, the circuit surface of the aluminum substrate is required to be flat to prevent the bonding wire from falling off the circuit surface. However, during the current aluminum substrate etching process, flying probe test marks will be left on the circuit surface, resulting in uneven pits on the circuit surface, thereby affecting the quality of the aluminum substrate. Contents of the invention [0003] The technical problem to be solved in the present invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06H05K3/22
CPCH05K3/06H05K3/22H05K2203/162
Inventor 冯宇翔华庆张土明
Owner GUANGDONG HIIC SEMICON LTD
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