High-frequency wire conductor polishing process

A high-frequency line and conductor technology, applied in the field of high-frequency line conductor polishing technology, can solve the problems of silver-plated conductor appearance scratches and unsatisfactory elongation, and achieve the effect of improving surface polishing efficiency and ensuring smoothness

Active Publication Date: 2022-04-22
CHANGZHOU HENGFENG SPECIAL CONDUCTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a high-frequency wire conductor polishing process to solve the following problems: (1) the softened silver-plated conductor is microscopically Inspect appearance scratches; (2) elongation that cannot meet special requirements

Method used

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  • High-frequency wire conductor polishing process
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  • High-frequency wire conductor polishing process

Examples

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Embodiment 1

[0032] see Figure 1-6 As shown, a high-frequency wire conductor polishing process includes the following steps:

[0033] Step 1. After the annealing section, the high-frequency wire conductor is processed by polishing equipment before the wire is taken up. First, the high-frequency wire conductor is sent into the polishing equipment;

[0034] Step 2, the high-frequency wire conductor is sent into the fixed mount 101 from the movable plate 104 on the top of the fixed mount 101, and one end of the high-frequency wire conductor passes through the cleaning sponge 205 inside the connecting plate 203, and the surface of the high-frequency wire conductor is connected with the cleaning sponge The inner wall of the wire passing hole 206 inside the 205 is in contact, and the impurities on the surface of the high-frequency wire conductor are cleaned by using the cleaning sponge 205;

[0035] Step 3: One end of the high-frequency wire conductor passes through the cleaning sponge 205 and...

Embodiment 2

[0038] see Figure 1-3As shown, the polishing equipment includes a frame 10, the front of the frame 10 is provided with a polishing mechanism 20, and the left side of the frame 10 front is provided with an annealing box, the polishing mechanism 20 includes a fixed frame 101, and the back side of the fixed frame 101 is in contact with the machine The front of the frame 10 is fixedly connected, the inside of the fixed frame 101 is provided with a movable frame 102, and the inside of the movable frame 102 is provided with a wire drawing die 103, wherein the wire drawing die 103 adopts a natural diamond mold with a compression ratio of 1-2%, and the fixed frame 101 The top and the bottom are all rotatably provided with movable plates 104, and the opposite sides of the two movable plates 104 are provided with cleaning assemblies, both sides of the fixed mount 101 are provided with slide plates 105, and the insides of the two slide plates 105 are respectively connected with the movab...

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Abstract

The invention discloses a high-frequency wire conductor polishing process which comprises the following steps: cleaning the surface of a high-frequency wire conductor, feeding the high-frequency wire conductor into a wire drawing die, and polishing the high-frequency wire conductor by using the wire drawing die. According to the high-frequency wire conductor polishing process, the natural diamond die with the compression ratio of 1-2% is arranged in the polishing mechanism, the diamond wire drawing die is used for polishing the surface of the high-frequency wire conductor at the front take-up section after the annealing section, the surface smoothness of the high-frequency wire conductor is recovered, and the problem that scratches exist on the appearance of the softened high-frequency wire conductor is solved; meanwhile, according to different elongation requirements, the sliding rate of the movable frame driven by the two servo electric cylinders can be controlled, and then the elongation of the high-frequency wire conductor is controlled; the cleaning assemblies are arranged above and below the fixing frame, the surface of the high-frequency wire conductor is cleaned through the cleaning sponge before and after the surface of the high-frequency wire conductor is polished through the diamond wire drawing die, and the smoothness of the surface of the high-frequency wire conductor is guaranteed.

Description

technical field [0001] The invention relates to the technical field of polishing processing, in particular to a high-frequency wire conductor polishing process. Background technique [0002] The common conductor production process adopts the continuous pulling and continuous retreating method, and the process flow is: unwinding→drawing→annealing→reeling. The wire diameter of the finished product is controlled by the sizing die, and the conductor is annealed by using the conductive principle of the electrode wheel. Adjust the annealing voltage parameters according to the process requirements, and monitor whether the voltage and current values ​​are constant. Finally, the conductor is received on the required bobbin with a certain take-up tension. [0003] At present, the processing of high-frequency wire conductors has the following defects: (1) The softened silver-plated conductor is microscopically inspected for appearance scratches. The conductor contacts the electrode w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/06B24B41/00B24B41/06
CPCB24B29/06B24B41/005B24B41/06
Inventor 王晓苹陈鼎彪杨念喜
Owner CHANGZHOU HENGFENG SPECIAL CONDUCTOR CO LTD
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