Lead positioning device for processing organic thin-film capacitor and assembling method

Abstract

The invention discloses a lead positioning device for organic film capacitor processing, an organic film capacitor comprises a capacitor shell, a capacitor core group and a lead, the lead positioning device comprises a first positioning tool body, a second positioning tool body and a positioning plug board, the first positioning tool body is provided with a first vertical through hole, and the second positioning tool body is provided with a second vertical through hole; a first vertical through hole is formed in the first positioning tool body, sinking platforms are arranged at the positions except the two ends of the first vertical through hole respectively, a shell mounting space is jointly formed above the two sinking platforms, lead limiting through holes are formed in the sinking platforms, inserting plate through holes are formed in the side wall of the first vertical through hole, a second vertical through hole is formed in the second positioning tool body, and the positioning inserting plate penetrates through the two inserting plate through holes. And the second positioning tool body is arranged above the positioning insertion plate. By designing the first positioning tool body, the second positioning tool body and the positioning insertion plate which are matched with one another, high-precision positioning of the lead can be achieved, the lead does not need to be bent, and the lead is better protected.

Description

Technical field [0001] The present invention relates to an organic thin film capacitor processing device, and more particularly to a lead positioning device and assembly method for processing of organic thin film capacitors. Background technique [0002] The organic thin film capacitor is widely used in a variety of power electronic circuits. For lead-in-line-type products, their lead spacing and lead relative housing edges affect whether the product can be properly installed on the PCB board. If the size tolerance of the product lead position is not properly controlled, the deviation is too large, which will cause the product that cannot be plated. [0003] The lead wire of the organic thin film capacitor is mainly welded to the electrode of the capacitor core group in the capacitor, and the lead is formed to relatively fixed positional relationship with the capacitor core set, so the pitch of the lead is mainly subject to capacitor core group length and lead. The influence of t...

AI Technical Summary

Problems solved by technology

[0007] (1) Use the correction block to correct the lead wire bending, which may cause a certain degree of damage to the lead wire during the lead wire bending correction process;

[0008] (2) After the lead wire is calibrated, the position of the lead wire is not positioned again. The position of the lead wire may shift during subsequent operations such as pouring and curing, thereby affecting the final effect of the calibration. The deviation of the lead wire position that can be achieved by the calibration fluctuates greatly , the out-of-tolerance phenomenon of product lead position and size occurs frequently, and the reject rate is high;

[0009] (3) The position of the lead wire is not positioned during lead wire welding and assembly of the capacitor core group, mainly relying on post-correction. When the deviation of the lead wire position is too large and the space for bending the lead wire is limited, this correction method will be difficult to achieve purpose, it will cause a large number of lead wires to be out of tolerance;

[0010] (4) Correction of lead wires is performed at the end of the pouring process. The entire pouring process is discontinuous. Multiple pours may cause an interface (different curing time) inside the potting compound, which will have a negative impact on the potting effect, and the operation of this method Production efficiency will also decrease

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