Residual material removing mechanism for liquid crystal panel

Abstract

According to the technical scheme, the residual material removing mechanism is characterized in that the residual material removing mechanism comprises an objective table and a residual material removing assembly, the objective table is used for fixing the liquid crystal panel, and the objective table can be of a turnover platform or a robot arm or other structures; the residual material removing assembly removes residual materials on one side of a circuit layer of the liquid crystal panel through a clamping jaw assembly A. The clamping jaw assembly A moves in the Z-axis direction under dragging of the first module and moves in the Y-axis direction under dragging of the Y-axis controller. The upper clamping jaw and the lower clamping jaw drag the upper friction part and the lower friction part to clamp the residual material area of the liquid crystal display panel when relatively translating under the control of the servo control system, and can be suitable for the liquid crystal display panels with different thickness specifications; and under dragging of the Y-axis controller, different friction forces are generated on the upper surface and the lower surface of the liquid crystal panel residual material area, meanwhile, airflow with certain pressure is applied to the separation area through the air pipe, and therefore the cut liquid crystal panel residual materials are separated.

Description

Technical field [0001] The removal sheave mechanism of the liquid crystal panel of the present invention belongs to the field of liquid crystal panel automation equipment. Background technique [0002] Materials such as liquid crystal panels require photolithographic electrodes, TFT (Thin Film Transistor, thin film transistors), and CF (Color Film, color filter), grout, IC (Integrated Circuit, Integrated Circuit) binding. The electrodes are etched on TFT glass by means of photolithography, and the IC needs to be bound to the electrode to complete the lighting control operation. However, since TFT and CF are made on the glass substrate of the same size, the electrodes on the TFT are covered by CF, resulting in the unable to complete the IC binding, requiring removal of CF glass regions covering on the TFT electrode, i.e., sheaves. [0003] At present, most of the equipment has no residual removal effect detection assembly, which generally improves the success rate of residual mate...

AI Technical Summary

Problems solved by technology

However, since TFT and CF are made on the same size glass substrate, the electrodes on the TFT will be covered by CF, resulting in the inability to complete IC bonding. It is necessary to cut off the CF glass area covering the TFT electrodes, that is, the residual material

[0003] At present, most of the equipment does not have residual material removal effect detection components. Generally, the success rate of residual material removal is improved by multiple blowing methods, and then the residual material removal effect is detected by manual sampling.

Manual detection is slow and easy to miss

With the thinning of the LCD panel and the increase in size, the difficulty of manual inspection is increased, or some residual materials cannot be removed after multiple air blowing, and it will increase the processing time, reduce the production cycle, and affect the production capacity.

Some undiscovered residues flow to downstream processes, causing further loss of materials and man-hours

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