Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Millimeter wave packaging antenna based on fan-out packaging technology

A packaging process, millimeter wave technology, applied in antennas, antenna parts, antenna supports/installation devices, etc., can solve the problems of reduced antenna transmission performance, large signal attenuation and attenuation, large signal transmission distance, etc. The effect of shortening transmission distance, reducing attenuation and loss, and improving transmission performance

Pending Publication Date: 2022-03-01
GUANGDONG UNIV OF TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, fan-out packaging is not yet mature enough for the packaging of millimeter-wave chips and antenna structures. There is a large signal transmission distance between the antenna radiation structure and the millimeter-wave chip, resulting in a large attenuation of the signal during transmission. and attenuation, reducing the transmission performance of the antenna

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Millimeter wave packaging antenna based on fan-out packaging technology
  • Millimeter wave packaging antenna based on fan-out packaging technology
  • Millimeter wave packaging antenna based on fan-out packaging technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] see figure 1 , this embodiment proposes a millimeter-wave packaged antenna based on fan-out packaging technology, including a chip package layer 1, an antenna radiation structure 2, an external substrate pad 3, a reflective metal layer 4, and a first passivation layer 5; The external substrate pad 3 is disposed under the chip packaging layer 1, the reflective metal layer 4 is disposed above the chip packaging layer 1; the first passivation layer 5 is disposed on the reflective metal layer 4 Above, the antenna radiation structure 2 is arranged above the first passivation layer 5; the antenna radiation structure 2 performs signal transmission with the chip packaging layer 1 through a conductor; the chip packaging layer 1 is soldered to the external substrate through a conductor Disc 3 performs signal transmission.

[0034] In the specific implementation process, the antenna radiation structure 2 directly performs signal transmission with the chip packaging layer 1 throug...

Embodiment 2

[0036] see Figure 2-Figure 10 This embodiment also proposes a millimeter-wave packaged antenna based on a fan-out packaging process, including an external substrate pad 3, a chip packaging layer 1, a reflective metal layer 4, a first passivation layer 5 and The antenna radiation structure 2, and at least one first signal via hole 6 and at least one second signal via hole 7; the first signal via hole 6 is arranged through the first passivation layer 5 and the reflective metal layer 4, and the second One end of a signal through hole 6 is connected to the antenna radiation structure 2, and the other end is connected to the chip packaging layer 1, and the antenna radiation structure 2 performs signal transmission with the chip packaging layer 1 through the first signal through hole 6; Two signal vias 7 are disposed in the chip packaging layer 1 , and the chip packaging layer 1 performs signal transmission with the external substrate pad 3 through the second signal vias 7 .

[00...

Embodiment 3

[0049] This embodiment proposes a millimeter-wave packaged antenna based on a fan-out packaging process, wherein the millimeter-wave bare chip 101 includes a chip floor 1011, and the millimeter-wave packaged antenna further includes at least one third signal via 8 and at least one first Four signal vias 9; the reflective metal layer 4 communicates with the chip floor 1011 through the third signal via 8; the reflective metal layer 4 communicates with the external substrate pad through the fourth signal via 9 3 connected.

[0050] In a specific implementation process, the reflective metal layer 4 communicates with the chip floor 1011 through the third signal via 8; the reflective metal layer 4 communicates with the external substrate pad through the fourth signal via 9 3 connected to realize the chip floor 1011, the reflective metal layer 4 and the reference potential point of the external substrate pad 3 are connected together, which can form a common ground with the floor of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a millimeter wave packaging antenna based on a fan-out packaging technology. The millimeter wave packaging antenna comprises a chip packaging layer, an antenna radiation structure, an external substrate bonding pad, a reflection metal layer and a first passivation layer. The external substrate bonding pad is arranged below the chip packaging layer, and the reflective metal layer is arranged above the chip packaging layer; the first passivation layer is arranged above the reflective metal layer, and the antenna radiation structure is arranged above the first passivation layer; the antenna radiation structure carries out signal transmission with the chip packaging layer through the conductor. And the chip packaging layer performs signal transmission with the external substrate bonding pad through the conductor. According to the antenna structure, signal transmission is directly carried out through the conductor and the chip packaging layer, and the chip packaging layer is longitudinally and electrically connected with the bonding pad of the external substrate, so that the signal transmission distance between the antenna and the chip is greatly shortened, attenuation and loss of signals in the transmission process are effectively reduced, and the transmission performance of the antenna is improved.

Description

technical field [0001] The present invention relates to the field of packaged antennas, and more particularly, relates to a millimeter-wave packaged antenna based on fan-out packaging. Background technique [0002] With the rapid development of wireless communication technology, people have higher and higher requirements for data transmission rate. The fifth-generation mobile communication technology (5G) is the latest generation of cellular mobile communication technology, which uses millimeter-wave band communication to increase communication capacity, thereby greatly improving the quality and rate of data transmission. Therefore, millimeter-wave antenna-in-package technology will be an important development direction in the communication field in the future. [0003] Fan-out packaging is a popular direction for packaging millimeter-wave chips and antenna structures in recent years. Its advantages such as high input and output density and integration flexibility, as well ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01Q1/22H01Q1/50H01Q1/00H01L23/66
CPCH01Q1/2283H01Q1/50H01Q1/002H01L23/66H01L2223/6677
Inventor 张俊何启明朱红博杨立森徐莎陈卓著
Owner GUANGDONG UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com