Production method of refrigeration infrared detector

Abstract

The invention provides a production method of a refrigeration infrared detector, which is applied to the technical field of semiconductors. Specifically, a concave or convex indium column is formed on a device chip or a reading circuit chip which forms the refrigeration infrared detector, and then, under the condition that the shape of the indium column of the chip on which the concave indium column is formed is kept unchanged, the indium column of the chip with the convex indium column is melted after being heated and then is connected with the indium column of the chip with the concave indium column in a face-down bonding mode so that a cold-hot face-down bonding mode (the specific implementation can be determined to be cold at the upper part and hot at the lower part, or hot at the lower part and cold at the upper part, and the temperature of the cold end is generally 0-30 DEG C, and the temperature of the hot end is generally 80-250 DEG C) is adopted. The purposes of enhancing the stability of the indium column, avoiding sideslip and offset of the indium column and ensuring that the indium column is not prone to falling off and deformation are achieved, physical connection and electrical connection of the reading circuit chip and the device chip can meet the process requirements, and finally the problem of the device is solved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a preparation method of a cooling infrared detector. Background technique [0002] With the continuous promotion and development of infrared applications, advanced infrared detection technology requires detectors to have higher spatial resolution and better target recognition capabilities. Infrared detector is a photoelectric device that converts infrared radiation into electronic signals, in which the photoelectric reaction is only carried out on the photosensitive element, and the subsequent signal processing process only involves electronic technology, so the infrared detection chip is the core of the infrared detector. core components. Since the current CMOS integrated circuit technology is mainly based on the Si process, the infrared detection chip needs to be mixed and integrated with the Si readout circuit through the indium column flip-chip interconnection technol...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for preparing a refrigerated infrared detector, so as to solve the problem of dislocation and sideslip of the indium column after the readout circuit chip and the device chip used to form the refrigerated infrared detector are flip-bonded, which leads to the readout circuit chip The physical connection and electrical connection with the device chip cannot meet the process requirements, and eventually cause the problem of device failure

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