Manufacturing method and manufacturing equipment for semiconductor device

Abstract

Provided are a manufacturing method and manufacturing equipment for a semiconductor device. According to the manufacturing method, circular heat dissipation copper sheets are provided for heat dissipation, and the edge of each heat dissipation copper sheet is provided with a positioning hole group, so that when the upper surface and the lower surface of a chip are respectively covered with the heat dissipation copper sheets, and preset soldering lugs are arranged between the heat dissipation copper sheets and the upper and lower surfaces of the chip, the chip can be quickly limited at preset positions in the heat dissipation copper sheets by inserting positioning pins into the positioning hole groups, and therefore, manual operation is reduced, the efficiency is improved, and the production cost is reduced. Meanwhile, as the surface area of the heat dissipation copper sheets is larger than that of the chip, heat dissipation can be better achieved, meanwhile, the chip can be protected against collision, and the requirements for chip protection and reliability are met.

Description

technical field [0001] The invention relates to the field of semiconductor device manufacturing, in particular to a semiconductor device manufacturing method and manufacturing equipment thereof. Background technique [0002] TVS diodes are widely used in the protection of semiconductors and sensitive devices, usually for secondary protection, for secondary protection after gas discharge tubes, and can also be directly used for primary protection of circuits. [0003] As a basic circuit component, the market demand for diodes is very large. At the same time, with the development of the market, the application field of semiconductor products is developing in two directions. One is getting thinner and thinner, which requires circuit protection devices. The volume is getting smaller and smaller, and the devices are developing towards miniaturization; at the same time, in some fields, the function integration is getting higher and higher, and the power of the circuit is getting h...

AI Technical Summary

Problems solved by technology

As the TVS power is getting bigger and bigger, the chip size of the product will increase accordingly. At the same time, the chip area will increase, and the product’s ability to resist packaging stress and heat dissipation will become more and more difficult. At the same time, the increase in chip area and materials will also make the device The production efficiency decreases and the production cost increases

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