Semiconductor device manufacturing method and manufacturing equipment thereof

Abstract

A manufacturing method of a semiconductor device and its manufacturing equipment. In the manufacturing method, a circular heat dissipation copper sheet is provided for heat dissipation, and the edge of the heat dissipation copper sheet is provided with a set of positioning holes. In this way, when the The upper and lower sides of the chip are respectively covered with heat-dissipating copper sheets, and there are preset solder pads between the heat-dissipating copper sheet and the upper and lower surfaces of the chip, so that the positioning pins can be inserted into the positioning hole group to quickly place the The chip is limited to the internal preset position of the heat dissipation copper sheet, which reduces manual operations, improves efficiency, and reduces production costs. At the same time, because the surface area of ​​the heat dissipation copper sheet is larger than that of the chip, it can not only dissipate heat better, but also protect the chip from bumps, meeting the needs of chip protection and reliability.

Description

technical field [0001] The invention relates to the field of semiconductor device manufacturing, in particular to a semiconductor device manufacturing method and manufacturing equipment thereof. Background technique [0002] TVS diodes are widely used in the protection of semiconductors and sensitive devices, usually for secondary protection, for secondary protection after gas discharge tubes, and can also be directly used for primary protection of circuits. [0003] As a basic circuit component, the market demand for diodes is very large. At the same time, with the development of the market, the application field of semiconductor products is developing in two directions. One is getting thinner and thinner, which requires circuit protection devices. The volume is getting smaller and smaller, and the devices are developing towards miniaturization; at the same time, in some fields, the function integration is getting higher and higher, and the power of the circuit is getting h...

AI Technical Summary

Problems solved by technology

As the TVS power is getting bigger and bigger, the chip size of the product will increase accordingly. At the same time, the chip area will increase, and the product’s ability to resist packaging stress and heat dissipation will become more and more difficult. At the same time, the increase in chip area and materials will also make the device The production efficiency decreases and the production cost increases

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