Soldering flux for anti-whitening solder wire and preparation method of soldering flux

A flux and solder wire technology, applied in welding equipment, welding medium, manufacturing tools, etc., can solve problems affecting the quality of electronic products, whitening, and lower reliability of surface insulation resistance, etc., to improve color, reduce whitening, The effect of improving weldability

Active Publication Date: 2022-02-01
云南锡业新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The residues of existing solder wire solder joints often appear whitish, and the bluish residues will lead to a decrease in reliability performance such as surface insulation resistance and electromigration, which directly affects the quality of electronic products. One of the urgent issues that solder wire manufacturers need to solve

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Prepare raw materials according to the following mass ratios:

[0018] Ethylene glycol monobutyl ether 2%

[0019] Butyl acetate 1.5%

[0020] Rapeseed Oil 1.0%

[0021] Paraffin 0.5%

[0022] AT-225 0.5%

[0023] Isomerized Decyl Ethoxylate 0.5%

[0024] Isomerized Tridecyl Polyoxyethylene Ether 0.5%

[0025] Stearic Acid 2.0%

[0026] Licosanthic Acid 1.5%

[0027] Dibromobutenediol 1.0%

[0028] 2,3-Dibromosuccinic acid 1.5%

[0029] Hydrogenated Rosin 60%

[0030] Polymerized Rosin 120 27.5%;

[0031] Prepare flux for solder wire as follows:

[0032] 1) Accurately weigh ethylene glycol monobutyl ether, butyl acetate, and rapeseed oil according to the above proportions, place them in a reaction kettle and heat them to 50°C to 60°C, stir for 2 to 3 minutes, then add paraffin, and continue at this temperature Stir for 3 to 5 minutes, cool down, and make a moisture-proof agent.

[0033] 2) Accurately weigh hydrogenated rosin and polymerized rosin 120 accord...

Embodiment 2

[0035] Prepare raw materials according to the following mass ratios:

[0036] Ethylene glycol monobutyl ether 3.0%

[0037] Butyl acetate 1.5%

[0038] Rapeseed Oil 1.0%

[0039] Paraffin 0.5%

[0040] AT-225 1.0%

[0041] Isodecanyl Polyoxyethylene Ether 1.0%

[0042] Isomerized Tridecyl Polyoxyethylene Ether 0.5%

[0043] Stearic acid 3.0%;

[0044] Behenic Acid 2.0%;

[0045] Dibromobutenediol 2.5%

[0046] Hydrogenated Rosin 42.0%

[0047] Polymerized Rosin 120 42.0%;

[0048] Prepare flux for solder wire as follows:

[0049] 1) Accurately weigh ethylene glycol monobutyl ether, butyl acetate, and rapeseed oil according to the above proportions, place them in a reaction kettle and heat them to 50°C to 60°C, stir for 2 to 3 minutes, then add paraffin, and continue at this temperature Stir for 3 to 5 minutes, cool down, and make a moisture-proof agent.

[0050] 2) Accurately weigh hydrogenated rosin and polymerized rosin 120 according to the above ratio, melt at a...

Embodiment 3

[0052] Prepare raw materials according to the following mass ratios:

[0053] Ethylene glycol monobutyl ether 4%

[0054] Butyl acetate 2.0%

[0055] Rapeseed Oil 0.5%

[0056] Paraffin 0.5%

[0057] AT-225 1.5%

[0058] Isomerized Decyl Ethoxylate 1.5%

[0059] Isomerized tridecanol polyoxyethylene ether 0.5%

[0060] Licosanthin 2.0%;

[0061] Dimer acid 2.5%;

[0062] 2,3-Dibromosuccinic acid 1.5%

[0063] Hydrogenated Rosin 50.0%

[0064] Polymerized Rosin 120 33.5%;

[0065] Prepare flux for solder wire as follows:

[0066] 1) Accurately weigh ethylene glycol monobutyl ether, butyl acetate, and rapeseed oil according to the above proportions, place them in a reaction kettle and heat them to 50°C to 60°C, stir for 2 to 3 minutes, then add paraffin, and continue at this temperature Stir for 3 to 5 minutes, cool down, and make a moisture-proof agent.

[0067] 2) Accurately weigh hydrogenated rosin and polymerized rosin 120, melt it at a temperature of 130-150°C, ...

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PUM

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Abstract

The invention discloses a soldering flux for an anti-whitening solder wire and a preparation method of the soldering flux. The soldering flux comprises the following components in percentage by mass: 5.0%-7.0% of a moisture-proof agent, 0.5%-1.5% of an antioxidant, 1.0%-2.0% of a nonionic surfactant, 6.0%-9.0% of an active agent and the balance of a film-forming agent. The soldering flux is high in activity, good in weldability and stability, not prone to splashing, capable of avoiding residue whitening after welding and suitable for high-reliability solder wire products.

Description

technical field [0001] The invention belongs to the technical field of electronic soldering materials, and in particular relates to a flux for anti-whitening solder wire and a preparation method thereof. Background technique [0002] With the rapid development of electronic information products, the requirements for the reliability of solder wire residue after welding are getting higher and higher. Among them, whether the residue after soldering is whitened after a period of time is one of the important indicators for evaluating the reliability of a solder wire. The residues of existing solder wire solder joints often appear whitish, and the bluish residues will lead to a decrease in reliability performance such as surface insulation resistance and electromigration, which directly affects the quality of electronic products. One of the issues that solder wire manufacturers urgently need to solve. Contents of the invention [0003] The purpose of the present invention is to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3613B23K35/362B23K35/40
Inventor 秦俊虎张欣卢红波朱文嘉唐丽赵中梅龙登成解秋莉李润萍于梦飞何江华沙文吉雷佳熙
Owner 云南锡业新材料有限公司
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