Wafer cleaning method and wafer cleaning device
A wafer and roller brush technology, applied in cleaning methods and utensils, cleaning methods using tools, chemical instruments and methods, etc., can solve the problems of time consumption, smaller groove size, affecting wafer cleaning efficiency, etc. The effect of ensuring cleaning effect, improving production efficiency and shortening running-in time
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[0043] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention, used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the embodiments of the present invention and the protection scope of the present invention . In addition to the embodiments described herein, those skilled in the art can also adopt other obvious technical solutions based on the contents disclosed in the claims and the description of the present application, and these technical solutions include adopting any modifications made to the embodiments described herein. Obvious alternative and modified technical solutions.
[0044] The accompanying drawings in the present specification are schematic diagrams to assist in explaining the concept of th...
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