Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Shock-absorbing antistatic high-temperature-resistant double-sided electronic adhesive tape and processing method thereof

An antistatic and high temperature resistant, electronic adhesive tape technology, applied in the direction of non-polymer adhesive additives, adhesives, conductive adhesives, etc., can solve the problems of reducing the use effect, shock absorption, antistatic and poor high temperature resistance, etc., to achieve Improve the use effect, improve the shock absorption effect, improve the antistatic effect

Pending Publication Date: 2022-01-14
苏州久末电子科技有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Adhesive tape is composed of base material and adhesive. Two or more unconnected objects are connected together by bonding. With the development of economy and the progress of science and technology, China has become the processing and production plant of the world's adhesive industry. And consumer countries, especially adhesive tapes, protective films and self-adhesives are widely used in electronics, communications, packaging, construction, papermaking, woodworking, aerospace, automobiles, textiles, metallurgy, machinery manufacturing, medical industries, etc. Double-sided electronics Tape is a kind of tape, but the existing double-sided electronic tape has poor shock absorption, antistatic and high temperature resistance, which reduces its use effect. Therefore, we propose a shock absorption type antistatic high temperature resistant Double Sided Electronic Tape

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Shock-absorbing antistatic high-temperature-resistant double-sided electronic adhesive tape and processing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] In the description of the application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "installed", "connected", etc. should be understood in a broad sense, such as "connected", which may be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an int...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a shock-absorbing antistatic high-temperature-resistant double-sided electronic adhesive tape and a processing method thereof. The shock-absorbing antistatic high-temperature-resistant double-sided electronic adhesive tape comprises an adhesive tape body, the adhesive tape body comprises a substrate layer, a polyurethane foaming layer is arranged at the bottom of the substrate layer, meanwhile, the bottom of the polyurethane foaming layer is coated with a flame retardant layer, the top of the substrate layer is coated with an antistatic agent layer, and a polytetrafluoroethylene rubber layer is arranged at the top of the antistatic agent layer. The polyurethane foaming layer and the polytetrafluoroethylene rubber layer are arranged, the overall damping effect of the adhesive tape can be effectively improved, the flame retardant layer is arranged and can conduct flame-retardant protection on the bottom of the adhesive tape, the polytetrafluoroethylene rubber layer can conduct flame-retardant protection on the top of the adhesive tape, and the antistatic agent layer is arranged, so that the adhesive tape has the antistatic capacity; and the antistatic adhesive layer is arranged, so that the overall antistatic property of the adhesive tape can be further improved on the premise of ensuring the viscosity of the adhesive tape, and the overall use effect of the adhesive tape is effectively improved through the matching of the structures.

Description

technical field [0001] The invention relates to the technical field of adhesive tapes, in particular to a shock-absorbing antistatic and high temperature resistant double-sided electronic adhesive tape and a processing method thereof. Background technique [0002] Adhesive tape is composed of base material and adhesive. Two or more unconnected objects are connected together by bonding. With the development of economy and the progress of science and technology, China has become the processing and production plant of the world's adhesive industry. And consumer countries, especially adhesive tapes, protective films and self-adhesives are widely used in electronics, communications, packaging, construction, papermaking, woodworking, aerospace, automobiles, textiles, metallurgy, machinery manufacturing, medical industries, etc. Double-sided electronics Tape is a kind of tape, but the existing double-sided electronic tape has poor shock absorption, antistatic and high temperature r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/29C09J7/30C09J9/02C09J175/04C09J131/04C09J161/24C09J129/14C09J123/22C09J11/04C09J11/06C09D163/00C09D123/34C09D161/06C09D111/00C09D5/18C09D7/61
CPCC09J7/29C09J7/30C09J9/02C09J175/04C09J11/04C09J11/06C09D163/00C09D5/18C09D7/61C09D7/70C09J2301/124C09J2301/16C09J2301/314C09J2301/408C09J2400/243C09J2427/006C09J2475/006C08L31/04C08L61/24C08L29/14C08L23/22C08K7/06C08K5/42C08L23/34C08L61/06C08L11/00C08K3/16C08K3/2279C08K7/14
Inventor 张丽
Owner 苏州久末电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com