Chip test equipment based on double integrating spheres and test method

Abstract

The invention relates to the technical field of chip testing, in particular to chip test equipment based on double integrating spheres and a test method. The equipment comprising an automatic supply device, an automatic alignment device, a test device and a storage device which are sequentially arranged along a chip transmission direction; the test device comprises a rotating disc, which is provided with at least two test stations which are oppositely arranged; a driving structure, which is arranged on one side of the rotating disc and comprises a support, a driving piece connected with the support and a sliding rail connected with the support in a sliding mode, wherein two mounting stations are arranged on the support side by side; a first integrating sphere and a second integrating sphere, which are arranged on the two mounting stations respectively, wherein the first integrating sphere or the second integrating sphere is aligned with the test station between the two mounting stations under the action of the driving piece, and the testable maximum power of the first integrating sphere and the testable maximum power of the second integrating sphere are different. According to the chip test equipment based on the double integrating spheres and the test method, chips with different powers and wavelengths can be measured at the same time, and the test efficiency is high.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a chip testing device and a testing method based on a double integrating sphere. Background technique [0002] An integrated circuit (Integrated Circuit, IC), also known as a microchip, chip or chip, is a way to miniaturize circuits (including semiconductor devices, as well as passive components, etc.), and is often manufactured on the surface of semiconductor wafers, widely used In various fields such as mobile terminals, computer equipment, face recognition, smart home, unmanned driving, and aerospace. With the development of the semiconductor industry, the thickness of integrated circuit chips is becoming thinner and thinner, and the processing and detection accuracy of chips is getting higher and higher. For the chip size manufactured by the manufacturer, the most common size is a rectangle. After the existing chip is processed, it needs to be detected by a detection me...

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Problems solved by technology

[0003] Therefore, the technical problem to be solved by the present invention is to overcome the defects that the chip testing device in the prior art cannot measure chips of different powers and wavelengths at the same time, the operation is complicated, and the testing efficiency is low, thereby providing a low-cost, high testing efficiency , convenient and flexible, chip testing equipment and testing methods based on double integrating spheres that can measure chips of different powers and wavelengths arbitrarily

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