Gold-thread-free Schottky diode and manufacturing method thereof

A technology of Schottky diodes and gold wires, which is applied in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of easy contact between gold wires and difficult welding of gold wires, etc., to improve waterproof performance, Improve heat dissipation and prolong service life

Active Publication Date: 2021-12-28
先之科半导体科技(东莞)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above problems, the present invention provides a Schottky diode free of gold wires and a manufacturing method thereof, without welding gold wires, which solves the problems that the gold wires are difficult to weld and the gold wires are easy to contact each other

Method used

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  • Gold-thread-free Schottky diode and manufacturing method thereof
  • Gold-thread-free Schottky diode and manufacturing method thereof
  • Gold-thread-free Schottky diode and manufacturing method thereof

Examples

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Embodiment 1

[0035] Such as Figure 1-5 Shown:

[0036] A gold wire-free Schottky diode, comprising an insulating package 1, a Schottky chip 2, a first pin 3, an auxiliary conductive sheet 4, and a second pin 5, the Schottky chip 2 is located in the insulating package 1 Inside, the lower end of the Schottky chip 2 is electrically connected to the first pin 3, and the upper end of the Schottky chip 2 is electrically connected to the auxiliary conductive sheet 4;

[0037] The second pin 5 is fixed on the bottom of the insulating package shell 1, and the number of the second pin 5 is four;

[0038] The insulating package shell 1 is provided with through holes consistent with the number of the second pins 5, and the through holes are located on the side of the auxiliary conductive sheet 4, and each through hole is filled with a conductive resin 6, and the auxiliary conductive sheet 4 is connected to the second pin. 5 are electrically connected through conductive resin 6 .

[0039] Preferabl...

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PUM

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Abstract

The invention provides a gold-thread-free Schottky diode, and the diode comprises an insulating packaging shell, a Schottky chip, a first pin, an auxiliary conducting strip and a second pin; the Schottky chip is located in the insulating packaging shell, the lower end of the Schottky chip is electrically connected with the first pin, and the upper end of the Schottky chip is electrically connected with the auxiliary conducting strip; the second pin is fixed at the bottom of the insulating packaging shell; the insulation packaging shell is provided with through holes, the number of the through holes is consistent with that of the second pins, the through holes are located on one side of the auxiliary conducting strip, each through hole is filled with conductive resin, and the auxiliary conducting strip is electrically connected with the second pins through the conductive resin. According to the Schottky diode and the manufacturing method thereof, gold wires do not need to be welded, and the problems that the gold wires are difficult to weld and the gold wires are prone to contact with one another are solved.

Description

technical field [0001] The invention relates to the technical field of Schottky diodes, in particular to a gold wire-free Schottky diode and a manufacturing method thereof. Background technique [0002] For Schottky diodes with multiple pins, the Schottky chip is usually connected to the pins by gold wire welding. This Schottky diode structure will have the following problems: ① Due to the size of the Schottky chip Small, gold wire welding is difficult, welding efficiency is low, and equipment cost is high; ②The gold wires are easy to contact during the packaging process, resulting in a short circuit. Contents of the invention [0003] In view of the above problems, the present invention provides a Schottky diode free of gold wires and a manufacturing method thereof, which eliminates the need for soldering gold wires and solves the problems of difficult soldering of gold wires and easy contact between gold wires. [0004] To achieve the above object, the present invention...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L23/31H01L23/49H01L23/367
CPCH01L23/3107H01L23/49H01L23/49548H01L23/3672H01L2224/32245H01L2924/181H01L2224/33181H01L2924/00012
Inventor 焦庆
Owner 先之科半导体科技(东莞)有限公司
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