Coil structure and plasma processing equipment

Abstract

The invention relates to the technical field of semiconductors, in particular to a coil structure which comprises at least one coil assembly. The coil assembly comprises a first coil and a second coil, the first coil and the second coil are wound to form an annular area, the first end of the first coil and the first end of the second coil are gradually close to an inner ring of the annular area, and the second end of the first coil and the second end of the second coil are gradually close to an outer ring of the annular area; the first end of the first coil is electrically connected with the first end of the second coil; and the first coil forms a first projection on a plane perpendicular to the axial direction of the coil structure, the second coil forms a second projection on the plane perpendicular to the axial direction of the coil structure, and the first projection and the second projection are in mirror symmetry. The coil structure can generate electromagnetic fields which are symmetrically distributed left and right, so that plasma which is uniformly distributed is formed, and the etching quality and the etching efficiency of a semiconductor are effectively improved.

Description

[0001] Cross References to Related Applications [0002] This application claims the priority of the Chinese Patent Application No. 202010578805.X, entitled "A Coil Structure and Semiconductor Processing Equipment", filed with the China Patent Office on June 23, 2020, the entire contents of which are incorporated herein by reference. Applying. technical field [0003] The invention relates to the technical field of semiconductors, in particular to a coil structure and plasma processing equipment. Background technique [0004] With the development of integrated circuit manufacturing technology, the requirements for the uniformity of the etching environment are getting higher and higher. In the etching process, the upper electrode is usually used to excite and generate plasma, and the uniformity of plasma distribution determines the uniformity of etching. Therefore, the upper electrode structure used to generate plasma, such as a coil structure, is very important for etching ...

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Problems solved by technology

[0006] The problems solved by the present invention include the asymmetry of the left and right distribution of the electromagnetic field of the coil structure in the prior art, which leads to the generation of uneven plasma and adverse effects on the etching quality or efficiency.

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