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Method for manufacturing optical assembly with microchip array and assembly

A technology of optical components and microchips, applied in optics, nonlinear optics, electrical components, etc., to improve market competitiveness, reduce chip size, and avoid optical interference

Pending Publication Date: 2021-12-10
SUNRICH SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] On the other hand, optical detection chips such as fingerprint recognition or facial recognition also need to be laid out in an array mode, which also involves the miniaturization of the chip size, and the technical problems that each unit cell (cell) must be isolated from lateral light interference by grid-shaped walls. , which is also the technical problem to be solved by the present invention

Method used

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  • Method for manufacturing optical assembly with microchip array and assembly
  • Method for manufacturing optical assembly with microchip array and assembly
  • Method for manufacturing optical assembly with microchip array and assembly

Examples

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Embodiment Construction

[0035] The present invention will be further elaborated below in conjunction with the accompanying drawings and specific embodiments. These examples should be understood as only for illustrating the present invention but not for limiting the protection scope of the present invention. After reading the contents of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent changes and modifications also fall within the scope defined by the claims of the present invention.

[0036] first preferred embodiment

[0037] An optical component with a microchip array provided by the first preferred embodiment of the present invention is an example of a backlight module for a liquid crystal display, please refer to Figure 1-Figure 4 and Figure 6 As shown, among them, figure 1 is a top view of the array substrate 10 in the first preferred embodiment of the present invention, and figure 2 yes figure 1 I...

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Abstract

The invention discloses an optical assembly with a microchip array. The optical assembly comprises an array substrate, a plurality of microchip crystal grains and a transparent packaging cover plate, wherein the array substrate is provided with a setting surface for forming a driving circuit of an array layout; the plurality of microchip crystal grains are correspondingly welded and fixed on the driving circuit of the array substrate, the microchips are used for emitting and / or receiving a piece of light, and a predetermined interval is formed between every two adjacent microchip crystal grains; and the transparent packaging cover plate comprises a light-transmitting cover plate body and a light shielding layer, the light-transmitting cover plate body is provided with an opposite surface facing the arrangement surface and a light penetrating surface opposite to the opposite surface, the light shielding layer is arranged on the opposite surface and corresponds to a plurality of grids at preset intervals of the microchips, and the thickness of the grid is less than the predetermined interval. In addition, the invention also discloses a manufacturing method of the optical assembly with the microchip array.

Description

technical field [0001] The present invention relates to an optical assembly with a microchip array, and moreover, the invention also relates to a method of manufacturing the optical assembly. Background technique [0002] Light-emitting diodes (LEDs, light-emitting diodes) replaced traditional small tungsten bulbs when they were invented, and were used as indicator lights on various devices: with the continuous improvement of phosphor materials and packaging technology, LEDs are gradually moving towards large-scale It is high lumen and has power-saving characteristics. Therefore, it imitates cold-cathode tubes in the form of light bars, and replaces the old cold-cathode tubes. [0003] Later, due to people's increasing requirements for the native contrast and picture response speed of LCD displays, someone proposed the concept of dynamic backlight, which prevents consumers from seeing the LCD by forcibly turning off the backlight power at the end of the picture cycle to prod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L33/48H01L33/58H01L33/62G02F1/133G02F1/13357
CPCH01L27/156H01L33/486H01L33/58H01L33/62G02F1/13306H01L2933/0033H01L2933/0058H01L2933/0066
Inventor 曾国书邱昱维庄弘毅
Owner SUNRICH SEMICON CO LTD
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