Process for manufacturing three-dimensional circuit through laser etching and plastic surface carbonization

Abstract

The invention provides a process for manufacturing a three-dimensional circuit through laser etching, plastic surface carbonization and chemical plating, and relates to the technical field of manufacturing of circuits on plastic surfaces. The process comprises the following specific steps that a plastic substrate for bearing the circuit is manufactured through injection molding; a pattern of the circuit is processed on the surface of a plastic part in a laser engraving mode, and the full carbonization effect of a circuit area on the surface of the plastic part is achieved through reasonable selection of a laser light source and optimization of laser parameters while laser is used for processing the circuit; metal is plated in the laser carbonization area through subsequent chemical plating, so that the metal circuit is manufactured on the surface of the plastic; and when the circuit is manufactured on the first-level appearance surface, the smoothness of a plating layer can be fully improved in combination with an optimized special treatment means, and the size of a step between the plating layer and the plastic is reduced, so that the subsequent spraying cost is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of manufacturing circuits on plastic surfaces, in particular to a process for manufacturing three-dimensional circuits by laser etching and carbonizing plastic surfaces. Background technique [0002] LDS (LASER DIRECT STRUCTURING, Laser Direct Structuring) is a manufacturing process that adds special metal complexes to plastic particles, and then creates three-dimensional circuits on the surface of plastic structural parts by laser molding. This process was invented by German LPK, because it can be highly integrated in antenna design and manufacturing, saves space and is convenient for antenna design and routing, so it has a very good reputation in the field of antenna manufacturing for smartphones and wearable devices. Application prospects. However, due to the patent threshold of LPK, the plastic particles used in this production process are expensive, and the laser equipment is required to use German LPK...

AI Technical Summary

Problems solved by technology

[0011] Aiming at the deficiencies of the prior art, the present invention provides a process for making three-dimensional lines by laser etching and carbonizing the plastic surface, which solves the problem of equipment and material costs in the LDS process and the reduction in toughness caused by the addition of modified components to the material. Plastic parts are easy to cracking problem

Our new three-dimensional circuit manufacturing process also effectively solves the related problems of the LAP process: complex laser parameter debugging, long proofing cycle; poor mass production stability, low yield rate, and it is difficult to meet the high standard manufacturing requirements of the mobile phone antenna industry; In order to improve Subsequent coating performance and coating adhesion laser scanning often need to cross two filling scanning methods, resulting in a significant reduction in laser processing efficiency

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