Double-circulation temperature control equipment and method for cascade refrigeration system

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to double-circulation temperature control equipment and method for a cascade refrigeration system. According to the double-circulation temperature control equipment for the cascade refrigeration system, a first compressor, a heat release channel of a first condenser and a heat absorption channel of a first evaporator sequentially communicate to form a first refrigeration loop; the first compressor, the heat release channel of the first condenser and a heat absorption channel of a second evaporator sequentially communicate to form a second refrigeration loop; a first circulating device communicates with a heat release channel of the first evaporator to form a first circulating loop; a second compressor, a heat release channel of a second condenser, a heat release channel of a first heat exchanger and a heat absorption channel of a third evaporator sequentially communicate to form a third refrigerating loop; and a second circulating device, a heat release channel of the second evaporator and a heat release channel of a third evaporator sequentially communicate to form a second circulating loop. Detection use of main process equipment or probes at various different temperatures can be met.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a double-cycle temperature control device and method for a cascade refrigeration system. Background technique [0002] In the integrated circuit manufacturing industry, after the chip processing process is completed, it is necessary to test the packaging process to detect qualified chips and check the process quality level. The test is to test each die on the wafer, install a probe made of gold wire on the detection head, and make contact with the contacts on the die to test whether its electrical characteristics meet the requirements. The wafer is still fixed on the electrostatic adsorption tray (ESC). In order to meet the requirements of the test process, the wafer needs to be tested at a specific temperature to improve the accuracy of the test. Therefore, it is necessary to control the temperature of the ESC. Some tests are carried out at room temperature,...

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Problems solved by technology

[0003] The present invention provides a double-cycle temperature control device and method for a cascade refrigeration system, which is used to solve the problem that the refrigeration system in the prior art has limited refrigeration temperature and cannot be applied to multiple The detection equipment is difficult to meet the defects of the test requirements, and realizes the low temperature below -60°C, which improves the load capacity and control accuracy, and realizes a multi-purpose machine at the same time, and satisfies the use of a variety of probe detection at different temperatures

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