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Radiator for heat dissipation of high-calorific-value VPX plug-in

A heat-generating and radiator technology, applied in electrical components, structural parts of electrical equipment, modification by conduction and heat transfer, etc., can solve the problems of large total heat and concentrated heat sources, and achieve uniform temperature and low manufacturing cost. , the effect of broad application prospects

Pending Publication Date: 2021-11-12
BEIJING INST OF RADIO MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above-mentioned technical problems, the present invention provides a radiator for heat dissipation of VPX plug-in with large calorific value, which solves the heat dissipation problem of large total heat and relatively concentrated heat source, and improves heat dissipation performance

Method used

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  • Radiator for heat dissipation of high-calorific-value VPX plug-in
  • Radiator for heat dissipation of high-calorific-value VPX plug-in

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Embodiment

[0036] Such as figure 1 and figure 2 As shown, the present embodiment provides a heat sink for heat dissipation of a large calorific value VPX plug-in, including: a heat dissipation substrate 1 and a heat pipe 2 .

[0037] One side of the heat dissipation substrate 1 is provided with heat dissipation fins 4 . The heat pipe 2 is connected to the other surface of the heat dissipation substrate 1 .

[0038] Wherein, the heat pipe 2 is pasted on the other surface of the heat dissipation substrate 1 , and the heat pipe 2 can conduct the heat of the entire heat dissipation substrate 1 to realize uniform heat of the entire heat dissipation substrate 1 .

[0039] Wherein, the heat pipe 2 can be bent according to the need, so as to realize the omnidirectional lamination of the other surface of the entire heat dissipation substrate 1 . The heat pipe 2 can be a solid pipe or a hollow pipe, and can be set as a hollow pipe in order to save cost.

[0040] Wherein, the shape of the heat...

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Abstract

The invention relates to a radiator for heat dissipation of a high-calorific-value VPX plug-in, and belongs to the technical field of heat dissipation of electronic components. The radiator comprises a heat dissipation substrate, wherein heat dissipation fins are arranged on one surface of the heat dissipation substrate; and a heat pipe is included and is connected to the other surface of the heat dissipation substrate. According to the radiator, the heat dissipation problems that the total heat is large and heat sources are concentrated are solved, and the heat dissipation performance is improved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic components, and in particular relates to a radiator for heat dissipation of a VPX plug-in with large calorific value. Background technique [0002] As the operating frequency and integration of electronic components continue to increase, the power consumption and heat generation of electronic components on the VPX plug-in are also increasing sharply, and the demand for heat dissipation is getting higher and higher. [0003] At present, the heat dissipation capacity of traditional ordinary radiators is difficult to meet the heat dissipation requirements. When the heat of electronic components on the VPX plug-in is large or the heat flux density is relatively concentrated, the temperature difference in different areas of traditional ordinary radiators is large. Among them, the downstream of the cold air The temperature of the components is high, and the temperature difference ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20418H05K7/2039
Inventor 陈彦刘剑
Owner BEIJING INST OF RADIO MEASUREMENT
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