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Copper-clad substrate for high-end printed circuit board, and preparation method thereof

A technology of printed circuit boards and copper-clad substrates, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., and can solve problems affecting signal transmission, microcracks, and substrate failures, etc.

Active Publication Date: 2021-11-12
江苏耀鸿电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the significant difference in the thermal expansion coefficient of copper and ceramics leads to microcracks on the ceramic side of the solder bonding layer and warping on the metal side when the AMB copper-clad ceramic substrate is subjected to cold and heat cycles, resulting in failure of the substrate. The copper clad substrate often causes the resistance of components to rise too fast during use due to insufficient heat dissipation during use, which affects signal transmission and reduces service life

Method used

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  • Copper-clad substrate for high-end printed circuit board, and preparation method thereof
  • Copper-clad substrate for high-end printed circuit board, and preparation method thereof

Examples

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Effect test

Embodiment 1

[0024] The invention provides a copper-clad substrate for high-end printed circuit boards, comprising a silicon nitride ceramic substrate and a copper foil layer covering at least one surface of the silicon nitride ceramic substrate, the silicon nitride ceramic substrate and copper foil An interface bonding layer is arranged between the layers, and the interface bonding layer includes a conductive film layer, a metal stress layer and a welding layer.

[0025] In a preferred embodiment, the thickness of the silicon nitride ceramic substrate is 0.6mm, the surface roughness is 0.5μm, the copper foil layer is oxygen-free copper, and the purity of the oxygen-free copper is more than 99.99%. , the thickness of the copper foil layer is 0.3mm, the thickness of the interface bonding layer is 5um, and the thickness ratio of the conductive film layer, the metal stress layer and the welding layer is 1:1.6:2.4.

[0026] In a preferred embodiment, the conductive film layer includes the foll...

Embodiment 2

[0039] The invention provides a copper-clad substrate for high-end printed circuit boards. The conductive film layer includes the following raw materials in parts by weight: 50 parts of polyimide resin, 14 parts of nano-thermal conductive material, 2 parts of lubricant, and 8 parts of filler. 65 parts and dispersant.

Embodiment 3

[0041] Different from Examples 1 and 2, the present invention provides a copper-clad substrate for high-end printed circuit boards, the conductive film layer includes the following raw materials in parts by weight: 60 parts of polyimide resin, nano thermal conductive material 18 parts, 3 parts of lubricant, 10 parts of filler and 80 parts of dispersant.

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Abstract

The invention discloses a copper-clad substrate for a high-end printed circuit board, and particularly relates to the technical field of copper-clad substrates. The copper-clad substrate comprises a silicon nitride ceramic substrate and a copper foil layer covering at least one surface of the silicon nitride ceramic substrate, and an interface bonding layer is arranged between the silicon nitride ceramic substrate and the copper foil layer. The interface bonding layer comprises a conductive film layer, a metal stress layer and a welding layer. The conductive film layer not only can effectively improve the heat dissipation efficiency of the copper-clad substrate, but also has a certain buffering effect on thermal stress generated by the copper-clad substrate under the cold and hot cycle condition, and the service life of the copper-clad substrate can be effectively prolonged; and the metal stress layer is subjected to electrochemical polishing and anodic oxidation treatment to form a rough surface structure with micropores, and the rough surface structure can effectively release thermal stress generated by the copper-clad substrate under the cold and hot cycle condition.

Description

technical field [0001] The present invention relates to the technical field of copper-clad laminates, and more specifically, the present invention relates to a copper-clad substrate for high-end printed circuit boards and a preparation method thereof. Background technique [0002] Ceramic copper-clad substrate is an electronic basic material made by directly sintering copper foil on the ceramic surface using DBC (Direct Bond Copper) technology. Because the ceramic copper-clad substrate not only has the characteristics of high thermal conductivity, high heat resistance, high electrical insulation, high mechanical strength, similar thermal expansion coefficient and low dielectric loss of ceramics, but also has the high conductivity and high conductivity of oxygen-free copper. Excellent welding performance is the key material for power module packaging, connecting chips and heat dissipation substrates in the field of power electronics, and is widely used in various electrical e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K1/02C08J5/18C08L79/08C08L79/04C08L79/02C08K3/28C08K3/22C08K3/34C08K3/36
CPCH05K3/022H05K1/0207C08J5/18C08J2379/08C08J2479/02C08J2479/04C08K2003/282C08K2201/011C08K2003/222C08K2003/2227C08K3/34C08K3/36Y02P20/10
Inventor 吴海兵陈应峰
Owner 江苏耀鸿电子有限公司
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