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Automatic taping and gluing device, carrier tape and taping method

A carrier tape and adhesive technology, which is applied in the directions of automatic packaging control, transportation and packaging, external support, etc., can solve problems such as offset, low work efficiency, and complex overall process, so as to reduce manufacturing costs, improve work efficiency, and simplify The effect of dispensing process

Pending Publication Date: 2021-11-05
东莞市新懿电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the self-adhesive process is added before the die-cutting of the solid film, the problem of bulk material adhesion will occur again, and the bulk material cannot be quickly and accurately put into the carrier tape
The existing technology also cannot give the solid glue coated with viscous glue during the tape weaving process. Only the solid glue is put into the carrier tape and then packaged, and the solid glue is not coated with glue, so that the solid glue is used by the end customer. , it is prone to serious offset, or the end customer needs to manually apply glue on the surface of the circuit board to fix the solid glue before use. The overall process is more complicated, the cost is high, and the work efficiency is low.

Method used

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  • Automatic taping and gluing device, carrier tape and taping method
  • Automatic taping and gluing device, carrier tape and taping method
  • Automatic taping and gluing device, carrier tape and taping method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] see figure 1 , an automatic tape and adhesive equipment, comprising:

[0041] The feeding mechanism 1 is used to transfer the workpiece 22 and place the workpiece 22 in the groove 20 of the carrier tape;

[0042] The sealing tape mechanism 2 is arranged at the lower station of the feeding mechanism 1, and the sealing tape mechanism 2 is used to seal the carrier tape with the workpiece 22 placed in the groove 20;

[0043]The glue spraying mechanism 3 is arranged at the lower station of the sealing tape mechanism 2, and the glue spraying mechanism 3 is used to align the through hole 21 of the carrier tape and spray glue to the workpiece 22 in the groove 20;

[0044] The winding mechanism 4 is arranged at the lower station of the glue spraying mechanism 3, and the winding mechanism 4 is used for winding the carrier tape after the glue spraying is completed.

[0045] Preferably, the glue spraying mechanism 3 includes a glue spraying assembly 5 and a first runner 6, and th...

Embodiment 2

[0057] Different from Embodiment 1, this implementation also has:

[0058] see figure 2 The glue spraying mechanism 3 also includes a back glue curing machine 7, which is arranged between the winding mechanism 4 and the glue spraying assembly 3, and the back glue curing machine 7 is used for curing in the groove 20 of glue.

[0059] In this embodiment, through the setting of the back glue curing machine 7, the back glue curing machine 7 is used to cure the glue in the groove 20, effectively reducing the fluidity of the glue, preventing the glue from flowing out, and at the same time, improving the adhesive force of the glue, Furthermore, the ability to fix the workpiece 22 is improved.

[0060] Specifically, the back glue curing machine 7 can be set as a UV lamp, also known as an ultraviolet lamp, which mainly uses the characteristics of ultraviolet rays to perform photochemical reactions, product curing, sterilization, medical inspection, etc. The UV lamp commonly used in...

Embodiment 3

[0063] Different from Embodiment 1, this embodiment also has:

[0064] see Figure 3-5 The feeding mechanism 1 includes a conveyor belt 8 and a tape carrier tray 9, the tape carrier tray 9 is rotatably arranged above the conveyor belt 8, and the tape carrier tray 9 is used for carrying and delivering the carrier tape 10 to the conveyor belt 8, so that The carrier tape is laminated and conveyed synchronously with the conveyor belt 8, and a plurality of feeding grooves 10 are arranged at equal intervals on the conveyor belt 8, and the feeding grooves 10 are used to correspond to the grooves 20 of the carrier tape one by one.

[0065] Preferably, the feeding mechanism 1 also includes a vibrating plate 11, a sensor 24, a feeding track 12 is provided between the vibrating plate 11 and the conveyor belt 8, the vibrating plate 11 is provided with a discharge port 13, the conveyor belt 8 is provided with a gap 14, and the feeding track One end of 12 is connected to the vibrating plat...

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Abstract

The invention discloses an automatic taping and gluing device, a carrier tape and a taping method. The automatic taping and gluing device comprises a feeding mechanism, a tape sealing mechanism, a glue spraying mechanism and a winding mechanism, wherein the feeding mechanism is used for conveying workpieces and placing the workpieces in grooves of the carrier tape, the tape sealing mechanism is arranged at the lower station of the feeding mechanism and used for packaging the carrier tape with the grooves containing the workpieces, the glue spraying mechanism is arranged at the lower station of the tape sealing mechanism and used for being aligned with through holes of the carrier tape and spraying glue to the workpieces in the grooves, and the winding mechanism is arranged at the lower station of the glue spraying mechanism and used for winding the carrier tape obtained after glue spraying. The workpieces have viscosity at the normal temperature, so that the workpieces can be fixed at specified positions, the situation that position deviation occurs due to vibration of chip mounting equipment and affects subsequent workpiece processing is avoided, meanwhile, it is unnecessary to additionally use a glue dispensing process, the chip glue dispensing process of a circuit board is simplified, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of automatic processing, in particular to an automatic tape braiding and adhesive backing device, a carrier tape and a tape braiding method. Background technique [0002] Taping machines can be divided into two categories: semi-automatic and fully automatic. They put bulk component products into the carrier tape after passing through inspection, reversing, and testing stations. With the continuous upgrading, refinement and high integration of electronic products, electronic components have also been converted from plug-in type to patch type to save the installation space of the circuit board and expand the function of the product. [0003] The solid adhesive does not have surface stickiness at room temperature. In actual operation, in order to facilitate the initial fixing effect of the solid adhesive during patching, it is necessary to coat the bottom of the solid adhesive with viscous glue so that the soli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B15/04B65B51/02B65B35/34B65B43/52B65B51/16B65B51/10B65B61/00B65B57/02
CPCB65B15/04B65B51/02B65B35/34B65B43/52B65B51/16B65B51/10B65B61/00B65B57/02
Inventor 黄伟希刘准亮王芳冯妙安
Owner 东莞市新懿电子材料技术有限公司
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