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Structure for preventing warping of single carrier

A carrier and warping technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of large laser measurement deviation, increased risk factor, and damage to equipment spare parts, so as to reduce the heating area and reduce the probability of scrapping , The effect of reducing warpage

Pending Publication Date: 2021-11-02
华天科技(南京)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the carrier is heated and deformed, it will first affect the stability of the vacuum suction of the product on the heating platform, resulting in an increase in the risk factor during product processing
Secondly, the heat deformation of the carrier will affect the flatness of the product on the heating platform, which will greatly increase the technical requirements for the equipment required for product processing. The main influencing factors are the difficulty of PR identification and the large deviation of laser measurement
If the warpage of the carrier continues to be serious during the heating process, the dispensing head will directly damage the chip, which will not only lead to the scrapping of the product, but also cause damage to the spare parts of the equipment
In addition, heat warping will cause additional stress on the vehicle and product on the track and vacuum platform. After the product is processed and the vacuum breaking stress is released, the product will collapse from the vehicle, which may easily cause abnormalities such as chipping and corner chipping.
Greatly increased product scrap

Method used

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  • Structure for preventing warping of single carrier
  • Structure for preventing warping of single carrier

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] The carrier body 1 is provided with a number of product positioning holes 2 and stress release holes 4. The product is placed on the carrier body 1 through the product positioning holes 2, and the stress release holes 4 are scattered and distributed on the carrier body 1. The stress release holes 4 is a circular structure. When the carrier body 1 is in a high temperature process, the heat is dissipated through a number of circular stress release holes, which reduces the heated area of ​​the carrier body 1 and reduces the warpage of the carrier body 1 .

Embodiment 2

[0046]The carrier body 1 is provided with a number of product positioning holes 2 and stress release holes 4. The product is placed on the carrier body 1 through the product positioning holes 2, and the stress release holes 4 are scattered and distributed on the carrier body 1. The stress release holes 4 has a rectangular structure. When the carrier body 1 is in a high temperature process, heat is dissipated through a number of rectangular stress release holes, which reduces the heated area of ​​the carrier body 1 and reduces the warpage of the carrier body 1 .

Embodiment 3

[0048] The carrier body 1 is provided with a number of product positioning holes 2 and stress release holes 4. The product is placed on the carrier body 1 through the product positioning holes 2, and the stress release holes 4 are scattered and distributed on the carrier body 1. The stress release holes 4 has a triangular structure. When the carrier body 1 is in a high temperature process, heat is dissipated through a number of triangular stress release holes, which reduces the heated area of ​​the carrier body 1 and reduces the warpage of the carrier body 1 .

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PUM

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Abstract

The invention provides a structure for preventing warping of a single carrier. According to the structure, multiple stress release holes are additionally formed in the carrier, so a heating area of the carrier in a heating process is reduced, the phenomenon that the carrier is warped and deformed after the temperature is continuously increased is avoided, the phenomenon that a product flies off from the carrier due to the fact that the carrier and the product receive extra stress on a track and a vacuum platform after the carrier is warped due to heating is avoided, the scrap probability of the product is reduced, the possibility that the product is crashed is lowered, and the machining difficulty during product machining is reduced.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a structure for preventing warpage of a single carrier. Background technique [0002] For products with a large single FCBGA chip size, it is generally necessary to increase its reliability through underfill. During the bottom filling process, the product needs to be heated to ensure the filling effect. Since the product needs to be processed in a single carrier, this requires the carrier to have excellent resistance to deformation, and high temperature is one of the important factors affecting the deformation of the carrier. When the carrier is heated and deformed, it will first affect the stability of the vacuum suction of the product on the heating platform, resulting in an increase in the risk factor during product processing. Secondly, the heat deformation of the carrier will affect the flatness of the product on the heating platform, which will greatly increase the tech...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
CPCH01L21/68785H01L21/68771H01L21/68778
Inventor 李思捷马勉之
Owner 华天科技(南京)有限公司
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