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High-temperature lead-free solder wire and preparation method thereof

A lead-free solder and solder wire technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of reduced welding efficiency and easy slippage of workpieces, and achieve the effect of improving processing strength, improving stability, and facilitating promotion.

Active Publication Date: 2021-09-28
YIK SHING TAT SOLDER MFR KUNSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above-mentioned related technologies, the inventor believes that there is a defect that the lead-free solder wire is relatively soft, and the staff tends to slip when holding the solder wire for welding, resulting in a decrease in the welding efficiency of the workpiece

Method used

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  • High-temperature lead-free solder wire and preparation method thereof
  • High-temperature lead-free solder wire and preparation method thereof

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Embodiment

[0040] The embodiment of the present application discloses a high-temperature lead-free solder wire. refer to figure 1 with figure 2 , a high-temperature lead-free solder wire, including a shell 1 and an inner core 2, the inner wall of the shell 1 is bonded to the cylindrical inner core 2, the outer wall of the shell 1 is in the shape of a spiral hexagonal column, and the outer wall of the shell 1 is along the spiral hexagonal column There are grooves 11 on the six edges of the solder wire, which improves the roughness of the outer wall of the solder wire, improves the stability of the staff holding the solder wire, and facilitates the staff to rotate the solder wire, quickly separate the soldering point from the solder wire, and The excess melted solder is accommodated in the groove 11 to prevent sharp ends or sticking of the solder joints. The grooves 11 are arranged obliquely to the plane where the radius of the inner core 2 lies, and the width of the grooves 11 graduall...

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Abstract

The invention relates to the field of brazing technologies, in particular to a high-temperature lead-free solder wire and a preparation method thereof. The problems that a lead-free solder wire is thin and soft, and is likely to slip when a worker holds the solder wire for soldering, and consequently the soldering efficiency of a workpiece is reduced are solved. The high-temperature lead-free solder wire comprises a shell made of tin alloy and an inner core made of soldering flux; and a plurality of spiral grooves are formed in the outer wall of the shell, and an anti-skid piece is arranged on the outer wall of the shell. The high-temperature lead-free solder wire has the advantages that the probability that the solder wire slips during soldering of workers is reduced, and the soldering efficiency is improved.

Description

technical field [0001] The present application relates to the field of soldering technology, in particular to a high-temperature lead-free solder wire and a preparation method thereof. Background technique [0002] The connection between electronic components and circuits often adopts the brazing method, that is, the metal material with a lower melting point is used as the solder, and the liquid solder is used to wet the base material, fill the joint gap, and diffuse with the base material to realize the weldment link . [0003] At present, the commonly used solder is lead-free solder wire. The center of the solder wire is filled with flux. After the solder wire is melted by Dianluo Iron, the solder drops to the soldering point. The flux improves the surface activity of the solder and isolates oxygen to prevent soldering. Oxidizes quickly and forms a joint after the solder condenses. [0004] In view of the above-mentioned related technologies, the inventor believes that t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 陈庆辉吴建新吴达铖吴建雄
Owner YIK SHING TAT SOLDER MFR KUNSHAN
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