Precursor composition for forming metal film, metal film forming method using same, and semiconductor device comprising same metal film

A metal film and precursor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, metallocenes, etc. Problems in the manufacture of zirconium-hafnium thin films

Active Publication Date: 2021-09-21
思科特利肯株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the above-mentioned prior art, a zirconium-containing thin film and a hafnium-containing thin film are produced by applying a zirconium compound and a hafnium compound respectively, but there is no disclosure of a method for producing a zirconium-hafnium-containing thin film by using the above-mentioned zirconium compound and a hafnium compound in combination.
[0005] In addition, in U.S. Patent Publication No. 8,962,078, a hafnium cyclopentadiene compound as a precursor of hafnium and zirconium cyclopentadiene as a precursor of zirconium are disclosed, but none of the above prior art discloses Method for producing zirconium-hafnium thin film by combined use of compound and hafnium compound
[0006] In addition, the Republic of Korea Laid-Open Patent Publication No. 10-2017-0016748 relates to a method of forming a substance film using a first source material and a second source material different from each other, and as the source material, CpZr(NMe 2 ) 3 、Hf(O-t-Bu) 4 , Hf(NEt 2 ) 4 、Hf(NEtMe) 4 , Hf(NMe 2 ) 4 , TDMAH, etc., including hints related to the combined use of zirconium compounds and hafnium compounds, but did not specifically disclose the method of manufacturing zirconium-hafnium-containing thin films

Method used

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  • Precursor composition for forming metal film, metal film forming method using same, and semiconductor device comprising same metal film
  • Precursor composition for forming metal film, metal film forming method using same, and semiconductor device comprising same metal film
  • Precursor composition for forming metal film, metal film forming method using same, and semiconductor device comprising same metal film

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Embodiment Construction

[0052] Next, the present invention will be described in more detail. The terms or words used in this specification and claims should not be limited to the usual or dictionary meanings to be interpreted, but should be based on what the inventor can do to describe his invention in the best way. The principle of properly defining the concepts of terms is to explain the meanings and concepts consistent with the technical ideas of the present invention.

[0053] The precursor composition for forming a metal film according to the present invention is characterized by including a zirconium compound represented by any one of the following chemical formulas 1 to 3 and a hafnium compound represented by any one of the following chemical formulas 4 to 6.

[0054] [chemical formula 1]

[0055]

[0056] [chemical formula 2]

[0057]

[0058] [chemical formula 3]

[0059]

[0060] [chemical formula 4]

[0061]

[0062] [chemical formula 5]

[0063]

[0064] [chemical form...

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Abstract

The present invention relates to a precursor composition for forming a metal film, characterized by comprising a zirconium compound represented by any one of chemical formulas 1 to 3 and a hafnium compound represented by any one of chemical formulas 4 to 6.

Description

technical field [0001] The present invention relates to a precursor composition for forming a metal film, a method for forming a metal film using the above precursor composition, and a semiconductor element comprising the above metal film, in particular to a method of atomic layer deposition (ALD) or chemical vapor deposition ( A precursor composition for forming a metal film containing zirconium or hafnium used in a CVD process, a method for forming a metal film using the precursor composition, and a semiconductor element including the metal film. Background technique [0002] As precursors for atomic layer deposition (ALD) or chemical vapor deposition (CVD) engineering, organometallic compounds in various forms have been developed and used. Silicon oxide is the material mainly used in the manufacture of semiconductor elements such as dynamic random access memory (DRAM) and capacitors by applying the above-mentioned deposition function, but recently due to the demand for hi...

Claims

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Application Information

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IPC IPC(8): C23C16/18C23C16/455C07F7/00H01L21/02H01L21/285H01L29/51C23C16/50C23C16/48C23C16/448
CPCC23C16/405C23C16/45529C23C16/45531C23C16/45553C07F17/00H01L21/02189H01L21/02181H01L21/02274H01L21/0228H01L21/02205H01L28/40C23C16/18C23C16/45536C07F7/00H01L21/28556H01L29/517C23C16/50C23C16/48C23C16/448H01L21/02194H01L21/28194
Inventor 洪畅成朴容主吴太勳黄仁天李相京金桐显
Owner 思科特利肯株式会社
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