Three-dimensional packaging phase change heat dissipation device

Abstract

The invention discloses a three-dimensional packaging phase change heat dissipation device, and mainly solves the problems that noise and vibration are prone to being generated, energy consumption is large, and reliability is poor in an existing three-dimensional packaging internal heat dissipation structure. The device comprises an upper packaging shell (1), a lower packaging substrate (3), a three-dimensional heat pipe (4) and a three-dimensional packaging lamination layer (7), a thermal silicon through hole part (6) and a micro-channel (9) are arranged in the three-dimensional packaging lamination layer, the three-dimensional packaging lamination layer is embedded with the three-dimensional heat pipe and then is arranged in a packaging cavity formed by the upper packaging shell and the lower packaging substrate, and a phase change material (2) is wrapped outside the three-dimensional packaging lamination layer. The thermal silicon through hole part penetrates through the through holes between the micro-channels, the three-dimensional packaging lamination layer transmits part of heat to the three-dimensional heat pipe through the thermal silicon through hole part, and heat in the micro-channels and the three-dimensional heat pipe is extracted through the phase-change material for external heat exchange. According to the invention, the uniformity of temperature distribution of the three-dimensional packaging lamination is improved, the internal heat dissipation of the three-dimensional packaging lamination is enhanced, the reliability of three-dimensional packaging is ensured, and the device can be used for packaging electronic equipment.

Description

Technical field: [0001] The invention belongs to the technical field of electronic packaging, and in particular relates to a heat dissipation device, which can be used for the packaging of electronic equipment. Background technique [0002] The rapid development of emerging fields such as 5G, Internet of Things, medical electronics, artificial intelligence, and high-performance computing has put forward higher requirements for advanced packaging. The existing mainstream packaging is two-dimensional packaging. [0003] However, due to the problems of power consumption, memory access, and on-chip interconnection in two-dimensional packaging, the further improvement of the performance of electronic devices has been hindered. Three-dimensional packaging with high frequency, high speed, high integration, and low energy consumption has emerged as the times require. Compared with traditional two-dimensional packaging, the size and weight of three-dimensional packaging can be reduce...

AI Technical Summary

Problems solved by technology

Because the device needs to be driven by mechanical components such as pumps, the system is relatively complex, which is not conducive to the miniaturization of three-dimensional packaging, and is prone to problems such as vibration and leakage, which affect the stability of electronic equipment.

[0007] In addition, the above existing technologies still have the following problems: 1) the two heat dissipation structures need to consume external energy, which is not conducive to energy saving; 2) the amount of heat that the working fluid can absorb by using sensible heat is limited, which limits the heat dissipation performance of the two heat dissipation structures

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