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Lead frame jumper wire combination device

A combination device and lead frame technology, applied in the direction of transportation and packaging, conveyor objects, electrical components, etc., can solve the problems of reduced production efficiency, operator fatigue, low combination efficiency, etc., to improve production efficiency, improve combination accuracy, The effect of improving positional accuracy

Active Publication Date: 2021-09-21
四川旭茂微科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the processes for combining jumper wires and lead frames are done manually, and the combination efficiency is low; when assembling, it is necessary to frequently flip the lead frame and the suction cups of the jumper wires, and the weight of various suction cups is relatively large, so it is very time-consuming to flip the suction cups Physical strength; working for a long time will not only further reduce production efficiency, but also cause excessive fatigue of the operator

Method used

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  • Lead frame jumper wire combination device
  • Lead frame jumper wire combination device
  • Lead frame jumper wire combination device

Examples

Experimental program
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Effect test

specific Embodiment approach

[0064] Specific embodiments: the frame suction cup 20 equipped with the lead frame and the wire jumper suction cup 50 equipped with jumpers move to the first turning mechanism 30 at the same time; until the frame suction cup 20 is located above the rotating rod 31, the jumper wire suction cup 50 is located on the rotating rod 31 and turned over Down after 180°. Then if Figure 16 As shown, the frame suction cup 20 is turned over 180° to the jumper suction cup 50 side by using the first turning mechanism 30, as Figure 18 As shown, after the frame suction cup 20 is combined with the jumper suction cup 50 , the claw 34 is released to separate the rotating rod 31 from the frame suction cup 20 . Then if Figure 19 As shown, the combined frame suction cup 20 and wire jumper suction cup 50 are moved into the U-shaped groove 611 of the rotating block 61 through the transfer plate 43 . later as Figure 20 After the frame suction cup 20 and the wire jumper suction cup 50 are turned...

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Abstract

The invention provides a lead frame jumper wire combination device. The lead frame jumper wire combination device comprises a first conveying mechanism, a first turnover mechanism, a second conveying mechanism and a second turnover mechanism. The first conveying mechanism comprises a first storage mechanism and a conveying plate. The first turnover mechanism is arranged at the tail end of the moving direction of the conveying plate; the first turnover mechanism comprises a pair of rotating rods and is used for overturning the frame suckers on the conveying plate by 180 degrees; vent holes are formed in the bottoms of the frame suckers; vent pipes corresponding to the vent holes are arranged on the top surface of the rotating rod; the second conveying mechanism comprises a second storage mechanism and a vacuum pipe, and a pipe valve is arranged on one side of the jumper wire sucker; the vacuum pipe is provided with air suction holes corresponding to each layer of jumper wire suckers of the stack; a transfer plate is movably arranged at the outlet end of the second storage mechanism in the output direction, and the first turnover mechanism is located on one side of the middle section of the moving track of the transfer plate; and the second turnover mechanism is arranged at the tail end of the transfer plate in the moving direction and comprises a rotating block. The automation degree is high, and the production efficiency is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor production, in particular to a lead frame jumper combination device. Background technique [0002] In semiconductors, a lead frame is usually used as a carrier, and then chips are bonded on each base island, and then connected by jumpers, and a package is formed using plastic, and finally cut to form a large semiconductor. At present, most of the processes for combining jumper wires and lead frames are done manually, and the combination efficiency is low; when assembling, it is necessary to frequently flip the lead frame and the suction cups of the jumper wires, and the weight of various suction cups is relatively large, so it is very time-consuming to flip the suction cups Physical strength; working for a long time will not only further reduce production efficiency, but also cause excessive fatigue of the operator. Contents of the invention [0003] In order to solve the deficiencies in ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67144H01L21/67721H01L21/67706H01L21/67718
Inventor 邹佩纯温正萍
Owner 四川旭茂微科技有限公司
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