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Double-layer suspension infrared thermopile and preparation method thereof

A thermopile and infrared technology, applied in the manufacture/processing of thermoelectric devices, thermoelectric devices using only the Peltier or Seebeck effect, electric radiation detectors, etc.

Pending Publication Date: 2021-09-14
上海迷思科技有限公司
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Problems solved by technology

[0007] In view of the above-mentioned shortcoming of the prior art, the object of the present invention is to provide a kind of double-layer suspension infrared thermopile and its preparation method, be used to solve the problems encountered in the preparation of high-performance, high-quality infrared thermopile in the prior art. to the problem

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  • Double-layer suspension infrared thermopile and preparation method thereof
  • Double-layer suspension infrared thermopile and preparation method thereof
  • Double-layer suspension infrared thermopile and preparation method thereof

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preparation example Construction

[0069] Such as figure 1 As shown, this embodiment provides a method for preparing a double-layer suspended infrared thermopile, comprising the following steps:

[0070] S1: provide the substrate;

[0071] S2: Forming a thermocouple composite layer on the substrate, the thermocouple composite layer includes a support medium layer covering the substrate, and a thermocouple material layer, an electrical insulation layer, and a metal layer located on the support medium layer interconnection layer;

[0072] S3: patterning the thermocouple composite layer to form an etching window exposing the substrate;

[0073] S4: forming a sacrificial layer covering the thermocouple composite layer and the etching window;

[0074] S5: forming a thermally conductive reflective layer covering the sacrificial layer;

[0075] S6: patterning the sacrificial layer and the heat-conducting reflective layer, forming a groove exposing the electrical insulation layer at the thermal junction end of the ...

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Abstract

The present invention provides a double-layer suspended infrared thermopile and the preparation method thereof. The heat conduction reflecting layer is introduced below the absorption part of the infrared absorption layer, so that the absorption rate can be improved, more heat can be more quickly concentrated to a hot junction end, a detection signal can be increased, and the detection performance can be improved; furthermore, by arranging a preset sacrificial layer, the etching window with a relatively small width can form a thermal insulation cavity with a relatively large width, so that the flexibility of the structural layout of the thermopile can be improved, and the space utilization rate of the device can be improved; and furthermore, the double-layer suspension infrared thermopile can be formed in the last step, so that the process complexity can be effectively reduced, the yield can be improved, and miniaturization and high performance of the infrared thermopile can be realized. The double-layer suspended infrared thermopile adopts a single-side processing method, has the advantages of simple process and high yield, and is suitable for mass production.

Description

technical field [0001] The invention belongs to the technical field of silicon micromechanical sensing, and in particular relates to a double-layer suspended infrared thermopile and a preparation method thereof. Background technique [0002] Infrared (IR) sensing arrays have been used in military, industrial, and consumer electronics markets, including night vision, autonomous driving, human behavior detection, non-contact temperature measurement, and more. For infrared thermal imaging, detectors need to be assembled into a focal plane array (FPA) to capture the shape and motion of the detected object. Compared with microbolometers and pyroelectric sensors, thermopile sensors are characterized by low power consumption, no flicker noise, and compatibility with CMOS processes, so they are lower in cost and are often used in low-cost fields such as air-conditioning wind direction control and fall detection. However, the design of thermopile infrared sensing arrays faces the c...

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Application Information

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IPC IPC(8): H01L35/32H01L35/34G01J5/12
CPCG01J5/12H10N10/01H10N10/17
Inventor 倪藻李伟
Owner 上海迷思科技有限公司
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