Self-circulation immersion jet power supply module

Abstract

The invention relates to a self-circulation immersion jet power supply module which comprises a shell and a circuit board located in the shell. A refrigerant liquid inlet and a refrigerant liquid outlet are formed in the shell, an immersed pump and a jet pipe are arranged in the shell, one end of the jet pipe is connected with the immersed pump, jet holes are distributed in the jet pipe, and the shell is filled with an insulating cooling liquid. The interior of the shell is filled with the insulating cooling liquid. Compared with the prior art, by using the module of the invention,the circuit board is completely soaked in the insulating cooling liquid, a thermal resistance between a power device on the circuit board and a refrigerant can be reduced, and therefore the heat dissipation efficiency is improved, the power supply module can have the smaller size and the higher power density, and a wind noise is avoided. Meanwhile, the immersed pump and the jet pipe can accelerate flowing and circulation of the insulating cooling liquid, and the heat dissipation effect is improved.

Description

technical field [0001] The invention relates to the field of heat dissipation of power modules, in particular to a self-circulating submerged jet power module. Background technique [0002] With the development of new infrastructure construction, new energy vehicle charging piles and data center construction equipment have attracted attention, both of which are infrastructure construction based on electricity, so the power demand for power modules for power conversion is increasing. Power density requirements are getting higher and higher. As the power density of the power supply module increases, the power density of heat generated along with it also increases. The existing power modules have the following problems: First, their heating power density has reached the heat dissipation limit of traditional air cooling, and air cooling alone cannot solve the higher heat. It takes up half of the space of the entire power module, which violates the technical trend of "light, th...

AI Technical Summary

Problems solved by technology

The existing power modules have the following problems: First, their heating power density has reached the heat dissipation limit of traditional air cooling, and air cooling alone cannot solve the higher heat. At the same time, the huge fans and heat sinks in the heat dissipation system basically occupy It occupies half of the space of the entire power module, which violates the technical trend of "light, thin, short and small" of power modules

Second, due to the impact of the harsh external environment, traditional air cooling is easily affected by dust, high temperature, rain, etc., resulting in a shortened service life of the power module to 1 / 3 compared to the condition without dust, high temperature, and rain.

The third is that the air-cooled noise is huge, and users suffer from huge noise pollution during use

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