Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

S-band dual-circular-polarization high-integration broadband phased array subarray antenna

A dual circular polarization, highly integrated technology, applied in antennas, antenna arrays, antenna grounding devices, etc., can solve problems such as narrow bandwidth, non-compliance with integration, generalization and productization, and poor isolation between array elements

Pending Publication Date: 2021-09-10
CHONGQING AEROSPACE ROCKET ELECTRONIC TECH CO LTD
View PDF9 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most common phased array antennas are circularly polarized by the discrete design of the antenna radiation unit and the 90° polarized bridge, which lacks integration; and limited by the properties of the microstrip antenna itself, the bandwidth is narrow and the isolation between array elements is poor. ; Does not meet the needs of integration, generalization and productization

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • S-band dual-circular-polarization high-integration broadband phased array subarray antenna
  • S-band dual-circular-polarization high-integration broadband phased array subarray antenna
  • S-band dual-circular-polarization high-integration broadband phased array subarray antenna

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic concept of the present invention, and the following embodiments and the features in the embodiments can be combined with each other in the case of no conflict.

[0023] Wherein, the accompanying drawings are for illustrative purposes only, and represent only schematic diagrams, rather than physical drawings, and should...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Copper thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to an S-band dual-circular-polarization high-integration broadband phased array subarray antenna, and belongs to the technical field of communication. The antenna comprises an independent radiation layer and a multi-layer microstrip patch antenna; the PCB 4 of the independent radiation layer is a Tacic single-sided core board; the multi-layer microstrip patch antenna is formed by mixing and pressing a single-face core board PCB 1, a single-face core board PCB 2 and a double-face core board PCB 3 through prepregs, so as to form a feed network strip line model. Taconic single-face core boards are adopted as the single-face core board PCB 1 and single-face core board PCB 2 of the multi-layer microstrip patch antenna, and a Taconic double-face core board is adopted as the double-face core board PCB 3; the independent radiation layer and the multi-layer microstrip patch antenna are fastened through a metal stud. The antenna has the advantages of being high in isolation degree, wide in working bandwidth, good in circular polarization characteristic and excellent in voltage standing wave ratio, and meanwhile the antenna has the advantages of being low in profile, simple in structure, easy to machine and the like.

Description

technical field [0001] The invention belongs to the technical field of communication, and relates to an S-band double-circular polarization high-integration broadband phased array sub-array antenna. Background technique [0002] At present, aerospace measurement and control has gradually developed from a traditional single-beam, single-target measurement and control system to a multi-beam, multi-target measurement and control system. However, the traditional single ground measurement and control station using parabolic antennas can no longer meet the requirements of simultaneous multi-target measurement and control tasks. The phased array antenna plus digital beamforming (DBF) architecture can achieve simultaneous multi-target measurement and control. The single station of this architecture can not only realize the measurement and control of more than a dozen targets arbitrarily distributed in the whole airspace, but also can adapt to the development trend of future measurem...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01Q1/38H01Q1/48H01Q1/50H01Q15/24H01Q19/10H01Q21/00H01Q21/06H01Q1/12
CPCH01Q1/38H01Q1/50H01Q1/48H01Q15/24H01Q21/065H01Q21/0006H01Q19/10H01Q1/12
Inventor 邹辰龙陈兵魏德肖崔雪琪陈秋锦肖满湘陆遥张睿邓建华
Owner CHONGQING AEROSPACE ROCKET ELECTRONIC TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com