Sheet-shaped prepreg for fan-out package sealing

A fan-out type and packaging technology, applied in the direction of electrical components, electrical solid-state devices, semiconductor devices, etc., can solve problems such as difficulties

Pending Publication Date: 2021-09-03
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to solve such problems, soft and low linear expansion materials are desired, but in general, there is a trade-off relationship between flexibility and low linear expansion, and it is considered to be very difficult to satisfy both properties by adding inorganic fillers

Method used

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  • Sheet-shaped prepreg for fan-out package sealing
  • Sheet-shaped prepreg for fan-out package sealing
  • Sheet-shaped prepreg for fan-out package sealing

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0202] Preparation Example 1: Preparation of Support (Preparation of Cellulose Nonwoven Fabric)

[0203] The slurry of microfiber CELISH KY110N (manufactured by Daicel Co., Ltd.) was diluted to 0.2% by weight, and a No. 5C filter paper was prepared using a paper machine with a decompression device (manufactured by Toyo Seiki Co., Ltd., standard square machine). Papermaking was performed as a filter cloth to obtain a moist cellulose nonwoven fabric.

[0204] Blotting papers were stacked on both sides of the obtained wet cellulose nonwoven fabric, and pressed at a pressure of 0.2 MPa for 1 minute. Next, it was pressed at a pressure of 0.2 MPa for 1 minute, then attached to a drum dryer (manufactured by Kumagai Riki Kogyo Co., Ltd.) whose surface temperature was set to 100° C., and dried for 120 seconds to obtain a cellulose nonwoven fabric ( Porosity: 60vol%, unit weight 9.9g / m 2 , Linear thermal expansion coefficient: 5ppm / K, thickness 25μm).

preparation example 2

[0205] Preparation Example 2: Preparation of Support (Preparation of Cellulose Nonwoven Fabric)

[0206] A cellulose nonwoven fabric (porosity: 60 vol%, basis weight 9.9 g / m) was obtained in the same manner as in Preparation Example 1 2 , Linear thermal expansion coefficient: 5ppm / K, thickness 200μm).

Embodiment 1～5

[0208] (Preparation of Sheet Prepreg)

[0209] Curable compositions were prepared according to the formulations described in Table 1.

[0210] After the cellulose nonwoven fabric or glass cloth obtained in Preparation Examples 1 and 2 was immersed in the obtained curable composition under reduced pressure, the solvent was removed under reduced pressure and the curable composition was impregnated again. A flat sheet-like prepreg (without through-holes) was produced by infiltration. Table 1 shows the film thickness of the obtained sheet-like prepreg.

[0211]

[0212](Manufacture of sheet-like prepreg with through-holes)

[0213] The sheet-like prepreg obtained above was extracted by punching to obtain a figure 2 A sheet prepreg with 37 10.5 mm square through holes is shown.

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Abstract

The purpose of the present disclosure is to provide: a sheet-shaped prepreg for fan-out package sealing that has both a low coefficient of linear thermal expansion and high flexibility, can form a cured product having excellent warping inhibition and crack resistance, and is unlikely to generate bubbles within the encapsulant when manufacturing reconstructed wafers; a fan-out package; and a method for producing the same. The sheet-shaped prepreg for fan-out package sealing of the present disclosure has a through-hole and / or a recess. In the fan-out package of the present disclosure, a semiconductor chip is sealed by a cured product of the sheet-shaped prepreg for fan-out package sealing. The electronic device of the present disclosure is equipped with the fan-out package of the present disclosure.

Description

technical field [0001] The present invention relates to a sheet-like prepreg for sealing a fan-out package. The present application claims the priority of Japanese Patent Application No. 2019-012599 for which it applied to Japan on January 28, 2019, the content of which is incorporated herein by reference. Background technique [0002] Fan-Out Package (Fan-Out Package) is a manufacturing technology of a semiconductor package including the following steps: after arranging a singulated semiconductor chip (die) on another wafer, sealing it to make a reconstituted wafer, A process of forming a redistribution layer (RDL: Re-Distribution Layer). [0003] In particular, Fan-out Wafer Level Packaging (FOWLP) has been attracting attention as one of the high-density mounting technologies for realizing high functionality and high speed of devices. FOWLP can make the area of ​​the package larger than that of the chip, so it has the following excellent characteristics: (1) The applicab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/24B32B27/04H01L23/29H01L23/31C08G59/18
CPCB32B27/04C08G59/18H01L23/29H01L23/31C08J5/245C08J5/045B32B27/20H01L23/293C09K3/12
Inventor 三宅弘人
Owner DAICEL CHEM IND LTD
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