Method for forming three-dimensional structure of multi-layer conductive sheet

Abstract

The invention provides a method for forming a three-dimensional structure of a multi-layer conductive sheet. The method comprises the following steps of: designing or acquiring a three-dimensional circuit structure model, and splitting the three-dimensional circuit structure model into a plurality of two-dimensional circuit models which are in interlayer connection through leads; according to the split two-dimensional circuit models, respectively preparing circuit boards comprising circuit structures corresponding to the two-dimensional circuit models; according to the structure of the three-dimensional circuit structure model, aligning and stacking the plurality of circuit boards so as to connect the circuit boards into a combined body; and placing the combined body in an acid medium, and conducting wire outgoing hole corrosion on the combined body through the acid medium induced by laser according to lead design positions. According to the forming method, the preparation process of the conductive sheet of the three-dimensional structure is effectively simplified, meanwhile, wire holes are obtained through corrosion of the acid medium induced by the laser. Compared with a traditional laser drilling mode, the wire hole forming process is milder and can effectively control the drilling depth, the focusing temperature requirement is far lower than the laser drilling temperature requirement, and the equipment threshold is effectively lowered.

Description

technical field [0001] The present application relates to the technical field of integrated circuits, in particular, to a method for forming a three-dimensional structure of multilayer conductive sheets. Background technique [0002] With the rapid development of the semiconductor industry, devices tend to be more and more miniaturized, and the number of I / Os is gradually increasing. The development trend of integrated circuits has also followed Moore's Law, and the density of integrated circuits has gradually increased. The main driving force for this increase in integration is the continuous reduction of feature size, and more devices can be integrated in a specific area, but this is mainly in the two-dimensional direction, and the integration density cannot be further improved. [0003] In the prior art, there are also circuit structures with some three-dimensional structures. Generally, the forming method of layer-by-layer online accumulation is adopted. Independent ci...

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Problems solved by technology

The main driving force for this increase in integration is the continuous reduction of feature size, and more devices can be integrated in a specific area, but this is mainly in the two-dimensional direction, and the integration density cannot be further improved.

[0003] In the prior art, there are also circuit structures with some three-dimensional structures. Generally, the forming method of layer-by-layer online accumulation is adopted. Independent circuit boards are prepared by laser drilling and then welding wires or flying wires, but this method has higher requirements for equipment

[0004] For the above problems, there is no effective technical solution

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