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Laser sintering forming method

A laser sintering molding and laser technology, which is applied in laser welding equipment, manufacturing tools, and improving energy efficiency, can solve problems such as inability to guarantee connection reliability, and achieve the effects of improving connection reliability, enhancing bonding, and stabilizing the connection

Active Publication Date: 2021-08-20
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the laser irradiation is only carried out on the surface of the ink, the connection between the ink and the transparent substrate is realized by laser penetration, so there are still gaps, and the reliability of the connection cannot be guaranteed.

Method used

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  • Laser sintering forming method

Examples

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Effect test

no. 1 example

[0032] Such as figure 1 Shown is the first embodiment of a laser sintering molding method of the present invention, including the following steps:

[0033] First roughen the glass carrier 1, preferably, roughen the glass carrier 1 by physical engraving or chemical etching, so that the subsequent metal can be applied to the glass carrier 1 and increase the friction between the metal and the glass carrier 1 The force makes it easier for the metal to adhere to the glass carrier 1.

[0034] a. Smear the paste 3 containing nano-metal particles on the position to be sintered on the surface of one side of the glass carrier plate 1; when making the paste 3 containing nano-metal particles, the nano-metal particles need to be added to the organic alcohol reagent, Then add rosin and flux to form a paste 3 . When making the paste 3, the metal with the same particle size is used to make the paste 3, which can make the fusion of the metal and the glass carrier 1 more uniform, and keep the...

Embodiment 2

[0054] The following is the second embodiment of a laser sintering molding method of the present invention. This embodiment is similar to Embodiment 1, except that the particle size of the nano-metal particles used is 80nm, and the particle size is 80nm. The nano metal particles are added to the ethylene glycol solution to form a paste 3 with a solid content of 85%; the paste 3 is evenly spread on the roughened glass carrier 1 through the drip nozzle 4, and the thickness of the applied paste 3 is 4 μm. As in Example 1, laser irradiation was performed on both sides of the glass carrier 1 and the paste 3 respectively; and then cleaned with ethylene glycol solution to complete single-sided sintering of the surface of the glass carrier 1 . Repeat the above steps until the sintering of the surface on the other side of the glass carrier 1 is completed; after the paste 3 is sintered and cleaned, use a high-power laser to drill a circular hole with a diameter of 4 μm, add the above pas...

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Abstract

The invention relates to the technical field of laser processing of circuit boards, in particular to a laser sintering forming method. The method comprises the following steps that a, paste containing nano metal particles is applied to a to-be-sintered position on the surface of one side of a glass support plate; b, the same positions of the two sides of a combination of the glass support plate and the paste are subjected to laser irradiation; c, single-side sintering of the glass support plate is completed; d, the steps a to c are repeated to complete sintering of the surface of the other side of the glass support plate; e, laser is enabled to penetrate through metal and the glass support plate, the upper and lower surfaces of which are sintered; d, a penetrated area is filled with paste containing nano metal particles; and f, laser irradiation is conducted on the paste, so that the nano metal particles in the paste are combined with the metal on the upper and lower surfaces, and circuits on the upper and lower surfaces are enabled to be in communication. The method aims to overcome the defects in the prior art, and provides the laser sintering forming method, so that the connection reliability of glass and the metal can be improved, a connection effect of the glass and the metal is better, the glass and the metal are not easy to fall off, and connection is more stable.

Description

technical field [0001] The invention relates to the technical field of laser processing circuit boards, and more specifically, to a laser sintering molding method. Background technique [0002] Circuit board is the support body of electronic components and the carrier of electrical connection. With the development of material science, the materials that can be used as circuit board are also increasing. In recent years, the rapid development of liquid crystal display uses glass as the circuit board material. As a circuit board, glass not only meets the needs of light transmission, but also plays the original role of the circuit board. However, the traditional welding method has poor bonding between glass and metal circuits and is easy to fall off. [0003] Chinese patent CN107378231B discloses a method of using metal nano-ink to prepare a metal structure on the surface of a transparent material. By placing the transparent substrate in the metal nano-ink, irradiating the subst...

Claims

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Application Information

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IPC IPC(8): B22F3/105B22F3/24B23K26/382
CPCB22F3/105B22F3/24B23K26/382B22F2003/248Y02P10/25
Inventor 杨冠南张海德崔成强张昱
Owner GUANGDONG UNIV OF TECH
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