Flexible circuit board processing method and device and apparatus

Abstract

The invention discloses a flexible circuit board processing method and device and an apparatus. By adding electricity between the surface of a steel sheet of a target circuit board, namely a flexible circuit board with an unqualified steel sheet grounding resistance value and a ground wire so as to generate electric arcs among the conductive particles in a conductive adhesive to thereby damage an insulating resin layer among the conductive particles, the resistance value of the conductive adhesive is reduced, the good conductivity is obtained, and whether the grounding resistance value of the steel sheet of the target circuit board is qualified or not is detected again after power-on is finished, so that the steel sheet grounding resistance of the target circuit board can be effectively reduced, and products with defective steel sheet grounding resistance values can be converted into good products, the product yield is improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board testing, in particular to a flexible circuit board processing method, device and equipment. Background technique [0002] Steel sheets play an important role in the grounding structure of a flexible printed circuit (FPC). Due to the rigidity and electrical surface requirements of flexible circuit boards, most flexible circuit boards currently use a combination of steel sheets and conductive adhesives to improve product performance and achieve superior high conductivity and broadband shielding characteristics. One of the more commonly used steel sheet grounding structures is to use conductive adhesive to bond the steel sheet for grounding. For example, a layer of conductive adhesive is pasted between the FPC and the steel sheet, and the grounding performance is achieved through pressing and baking. However, due to problems such as operating parameters and equipment flatness during the lamina...

AI Technical Summary

Problems solved by technology

At present, for the defective products that fail the test, the main solution is to rework the existing steel sheet grounding resistance defective products, but because the products have been pressed and the conductive adhesive has dead glue, and the parts have been finished The products also need to consider issues such as parts avoidance, and often end up being scrapped, which is not conducive to improving product yield and reducing production costs

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