Chip cutting control method and system, equipment and computer readable storage medium

Abstract

The invention discloses a chip cutting control method and system, equipment and a computer readable storage medium. The method comprises the following steps: acquiring an initial image of at least one chip cutting channel on a wafer to be cut; processing the initial image of the chip cutting channel through a target detection model, obtaining a first target image of the chip cutting channel, wherein the first target image is provided with a first edge line of the chip cutting channel; carrying out edge line positioning analysis on the first target image, and obtaining a second target image of the chip cutting channel, wherein the second target image is provided with a second edge line of the chip cutting channel; calculating a target cutting position according to a second edge line of the second target image; and controlling a cutting device to cut the chip according to the target cutting position. According to the invention, the chip production efficiency is improved, the correction and alignment precision of the cutting knife is improved, the rejection rate of products is reduced, the production cost is reduced, and the full automation of the chip cutting process is realized.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a chip cutting control method, system and equipment, and a computer-readable storage medium. Background technique [0002] In recent years, electronic consumer products have gradually become popular in all aspects of people's lives. Semiconductor materials are the basis of these products, making the semiconductor industry a key focus industry in all countries in the world. The size, substrate material and package type of integrated circuit products are constantly changing due to the development of advanced technology. To meet the processing demands of these ever-changing workpieces, it is necessary to cut the wafer into discrete sized chips. The dicing machine is also called a dicing machine, which is a device for separating and cutting chips. As an important part of the post-packaging process of integrated circuits, the dicing machine has a direct impact on ...

AI Technical Summary

Problems solved by technology

[0004] At present, the existing methods are to correct and adjust the position of the cutting knife of the chip cutting machine manually. The problems of this method: 1. It is time-consuming to align the cutting line manually, the efficiency is too low and it requires labor costs; 2. Manpower In the process of knife setting, it is easy to be affected by factors such as human subjective factors and fatigue caused by long-term work, which will affect the accuracy of knife setting, make deviations in the cutting process, and cause scrapping; 3. It is impossible to realize the real full-scale Automated generation

Images