Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Main oscillation power amplification laser and preparation method thereof

A technology of power amplifier and power amplification, which is applied in the direction of lasers, laser components, semiconductor lasers, etc., can solve the problems of high power output difficulties, reduced beam quality, and small lateral size of the ridge waveguide, and achieve good beam quality.

Pending Publication Date: 2021-08-03
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
View PDF13 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the continuous expansion of the application field of high-power semiconductor lasers and the improvement of the output power requirements of semiconductor lasers, high-power semiconductor lasers with good beam quality have become an important development direction, but in order to obtain high-quality high-power output on a single device very difficult
The ridge waveguide has a small lateral dimension, and the output power is limited to a lower range. Although increasing its lateral dimension can increase the output optical power, problems such as multi-transverse mode output will occur, which will reduce the beam quality.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Main oscillation power amplification laser and preparation method thereof
  • Main oscillation power amplification laser and preparation method thereof
  • Main oscillation power amplification laser and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that the directional terms mentioned in the embodiments, such as "upper", "lower", "left", "right", "front", "rear", etc., are only referring to the directions of the drawings, therefore, The directional terms used are illustrative and not intended to limit the invention.

[0036] An embodiment of the present invention provides a method for preparing a main oscillation power amplified laser, such as figure 1 As shown, including operations S101 to S104:

[0037] In operation S101, an epitaxial wafer having a separation-confined heterostructure is grown on a substrate.

[0038] The epitaxial layer is grown on the substrate by Metal-organic Chemical Vapor Deposition (MOCVD), wherein the epitaxial layer inc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a main oscillation power amplification laser. The main oscillation power amplification laser comprises a substrate; an epitaxial layer arranged on the substrate, wherein the epitaxial layer sequentially comprises a lower limiting layer, a lower waveguide layer, an active layer, a first upper waveguide layer and a second upper waveguide layer from the substrate to the top, and the second upper waveguide layer is in contact with a partial region of the first upper waveguide layer; a main control oscillator structure which is arranged on the surface of the first upper waveguide layer, and is a ridge-shaped waveguide structure; and a power amplifier structure which is arranged on the surface of the second upper waveguide layer, is coupled with the master control oscillator structure, and is a conical waveguide structure.

Description

technical field [0001] The invention relates to the field of semiconductor lasers, in particular to a main oscillation power amplified laser and a preparation method. Background technique [0002] In recent years, with the maturity of semiconductor laser technology, significant progress has been made in the research of high-power semiconductor lasers at home and abroad. High-power semiconductor lasers not only have the advantages of small size, light weight, high conversion efficiency, long life, high reliability, and simple structure, but their manufacturing process is also compatible with the production process of semiconductor integrated circuits, and has become the core of current optoelectronic devices. technology. High-power semiconductor laser is a kind of optoelectronic device with a wide range of uses. Its biggest feature is the diversity of wavelengths, almost including 650-1700nm. It is widely used in communications, military, industry, medical and other fields. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/026H01S5/065H01S5/20H01S5/22H01S5/30
CPCH01S5/0265H01S5/0655H01S5/20H01S5/22H01S5/3013
Inventor 刘素平潘智鹏马骁宇李伟熊聪仲莉林楠
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products