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Preparation method of soldering paste for automobile control panel and homogenizing equipment of preparation method

A technology of automobile control and solder paste, applied in welding equipment, welding medium, metal processing equipment, etc., can solve problems such as high temperature oxidation, achieve the effects of homogenizing material particles, improving oxidation resistance, and anti-corrosion electrical insulation

Inactive Publication Date: 2021-08-03
江苏博蓝锡威金属科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with tin-lead solder paste, the melting point of lead-free SnAgCu series solder paste is about 34°C higher, which brings serious problems such as high-temperature oxidation in the soldering process, and proposes a new solution for the flux used in lead-free solder paste. More stringent requirements, so traditional fluxes are no longer suitable

Method used

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  • Preparation method of soldering paste for automobile control panel and homogenizing equipment of preparation method
  • Preparation method of soldering paste for automobile control panel and homogenizing equipment of preparation method
  • Preparation method of soldering paste for automobile control panel and homogenizing equipment of preparation method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] An embodiment provided by the present invention: a preparation method of solder paste for an automobile control board:

[0032] The solder paste is made of tin powder and solder paste with a mass ratio of 85:15; among them, the tin powder includes the following components by weight: 5 parts of bismuth alloy solder powder, 85 parts of Sn-Ag-Cu series solder powder , 4 parts of nano-titanium particles and 6 parts of graphene, the solder paste is composed of the components in parts by weight: 30 parts of disproportionated rosin, 10 parts of surfactant, 35 parts of organic solvent, 15 parts of organic resin, 5 parts of zinc chloride servings and anti-aging agent 5;

[0033] The preparation method of solder paste comprises the following steps;

[0034] S1: Encapsulate the above-mentioned tin-bismuth alloy solder powder, Sn-Ag-Cu series solder powder and nano-titanium particles in a vacuum quartz tube, and then fill it with high-purity nitrogen protective gas;

[0035] S2: ...

Embodiment 2

[0043] The difference between the second embodiment and the first embodiment is that

[0044] In step S5, pour into a vacuum mixer and stir at a low speed for 12-18 minutes, then fill with nitrogen and stir at a medium speed for 50-60 minutes to obtain solder paste.

Embodiment 3

[0045] Embodiment 3 differs from Embodiment 1 in that

[0046] The solder paste is made of tin powder and solder paste with a mass ratio of 85:15; among them, the tin powder includes the following components by weight: 8 parts of bismuth alloy solder powder, 82 parts of Sn-Ag-Cu series solder powder , 4 parts of nano-titanium particles and 6 parts of graphene, and the described soldering paste is composed of each component in parts by weight: 45 parts of disproportionated rosin, 8 parts of surfactant, 32 parts of organic solvent, 5 parts of organic resin, chlorinated Zinc 5 parts and anti-aging agent 5.

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Abstract

The invention discloses a preparation method of soldering paste for an automobile control panel and homogenizing equipment of the preparation method. The soldering paste is prepared from tin powder and paste flux in a mass ratio of 85: 15, wherein the tin powder comprises the following components of bismuth alloy solder powder, Sn-Ag-Cu series solder powder, nano titanium particles and graphene, the flux paste comprises the following components of disproportionated rosin, a surfactant, an organic solvent, organic resin powder, zinc chloride powder and an anti-aging agent, and the homogenizing equipment comprises a tank body, a stirring mechanism and a spraying mechanism. According to the method, graphene in a proper proportion is added, and the graphene interacts with solid solution titanium crystals, so that solid solution titanium preferentially reacts with oxygen, a thin and compact oxidation film is instantly formed on the surface of the molten solder, the oxidation film can effectively prevent external oxygen from entering the film, copper in the molten solder can be inhibited from being oxidized, and the oxidation resistance of the solder alloy is remarkably improved.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a method for preparing solder paste for an automobile control board and a homogenizing device thereof. Background technique [0002] The car control board is also a kind of circuit board. Although its application range is not as wide as that of circuit boards, it is more intelligent and automatic than ordinary circuit boards. Simply put, the circuit board that can play a control role can be called a control board. Control boards are used inside everything from manufacturers' automated production equipment to small toy remote control cars for children. [0003] In the production of automobile control boards, it is necessary to use solder paste to initially adhere the electronic components to the predetermined position of the control board. At the welding temperature, with the volatilization of the solvent and some additives, the components to be welded will be welded to the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40B23K35/362B23K35/363
CPCB23K35/40B23K35/362B23K35/36B23K35/3613
Inventor 洪志刚刘光明
Owner 江苏博蓝锡威金属科技有限公司
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