Tin soldering paste for tin soaking machine

Abstract

The invention discloses tin soldering paste for a tin soaking machine. According to the weight percentage, the tin soldering paste for the tin soaking machine is made by mixing 85%-90% of lead-free solder alloy powder and 10%-15% of paste flux; the lead-free solder alloy powder comprises, by weight percentage, 5%-10% of zinc, 0.1%-0.2% of nickel, 0.4%-0.7% of copper, 2%-3.5% of bismuth, 0.8%-2.1%of graphene and the balance tin; and components of the paste flux comprise 35wt%-45wt% of an adhering film-forming agent, 0.5wt%-2wt% of modified rosin, 1%-2 % of castor oil diacyl antioxidant, 3%-6%of fluoroborate and the balance an organic solvent. The tin soldering paste is proper in viscosity and high in thixotropy, layering is not prone to occurrence during dispensing of a glue dispenser, and the tin soldering paste can be uniformly coated in an assigned welding area; oxidization of Zn in fused solder can be inhibited, and the anti-oxidizing performance of a solder alloy is remarkably improved; and the copper consumption phenomenon is sufficiently prevented.

Description

technical field [0001] The invention relates to the field of automatic tin dipping machines, in particular to a solder paste for tin dipping machines. Background technique [0002] In the use of wire rods, in order to prevent the wire rods from being oxidized or split, it is necessary to dip the wire rods into tin, which can effectively play an anti-oxidation effect, and then better help the product to be used later. The working efficiency of tinning the wire is low, and the quality of tinning is not good enough, so it is necessary to use a tinning machine to dip the wire. [0003] Solder paste is an important production link for the welding of electronic products. Traditional solder paste is gradually replaced because it contains a lot of lead and generates a lot of smoke. The use of low-silver solder alloys is the development trend of lead-free electronic assembly to improve cost performance. There are solder pastes prepared based on SAC305 in the market, but the disadv...

AI Technical Summary

Problems solved by technology

[0002] In the use of wire rods, in order to prevent the wire rods from being oxidized or split, it is necessary to dip the wire rods into tin, which can effectively play an anti-oxidation effect, and then better help the product to be used later. The work efficiency of tinning the wire is low, and the quality of tinning is not good enough, so it is necessary to use a tinning machine to dip the wire

[0003] Solder paste is an important production link for the welding of electronic products. Traditional solder paste is gradually replaced because it contains a lot of lead and generates a lot of smoke. The use of low-silver solder alloys is the development trend of lead-free electronic assembly to improve cost performance. There are already solder pastes based on SAC305 on the market, but the disadvantage is that the cost is relatively high