Conductive film repairing method
A conductive film and conductive grid technology, which is applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of conductive grid disconnection, uneven filling of conductive ink, micro deformation of base film, etc., and achieve High reliability, excellent uniformity of resistivity, and high success rate
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Embodiment 1
[0041] The mixed chemical solution 30 of the present embodiment is composed of the following substances in terms of mass percentage: copper sulfate 1.2%, potassium sodium tartrate 1.0%, sodium hydroxide 1.2%, formaldehyde 1.0%, and the temperature of the mixed chemical solution 30 is controlled to be 30-35 ℃, let stand for 1h.
Embodiment 2
[0043] The mixed chemical solution 30 of the present embodiment is composed of the following substances in terms of mass percentage: copper sulfate 1.2%, potassium sodium tartrate 1.0%, sodium hydroxide 1.2%, formaldehyde 1.0%, and the temperature of the mixed chemical solution 30 is controlled to be 35-40 ℃, let stand for 1h.
Embodiment 3
[0045] The mixed chemical solution 30 of the present embodiment is composed of the following substances in terms of mass percentage: copper sulfate 1.2%, potassium sodium tartrate 1.0%, sodium hydroxide 1.2%, formaldehyde 1.3%, and the temperature of the mixed chemical solution 30 is controlled to be 30-35 ℃, let stand for 1h.
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