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Microcrystalline glass solder and preparation method thereof, and method for connecting aluminum oxide ceramics

A technology of alumina ceramics and glass ceramics, which is applied in the field of glass ceramics solder and its preparation, and connection of alumina ceramics, which can solve the problem of affecting the mechanical properties of joints, the quality of alumina ceramic connections, increasing the difficulty of ceramic connection processes, and poor matching of thermal expansion coefficients and other problems, to achieve the effect of improving the connection quality, matching the thermal expansion coefficient, and reducing the welding temperature

Active Publication Date: 2021-07-16
JINGDEZHEN CERAMIC INSTITUTE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, at present, the glass-ceramic solders in the prior art generally have the problems of high melting point and poor matching of thermal expansion coefficient with alumina ceramics, which increases the difficulty of the ceramic connection process and brings defects such as pores and cracks, which greatly affects the joints. The mechanical properties and connection quality of alumina ceramics

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  • Microcrystalline glass solder and preparation method thereof, and method for connecting aluminum oxide ceramics
  • Microcrystalline glass solder and preparation method thereof, and method for connecting aluminum oxide ceramics

Examples

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Effect test

Embodiment 1

[0030] 1. A glass-ceramic solder in the present embodiment, its chemical composition is CaO 15wt%, Al 2 o 3 15 wt%, SiO 2 55wt%, ZnO 5wt%, B 2 o 3 10 wt%; the coefficient of thermal expansion of the glass-ceramic solder between 25 and 700°C is 6.2×10 -6 / °C.

[0031] 2. The preparation method of the glass-ceramic solder of the present embodiment, the following steps are as follows:

[0032] (1) Ball milling mixture

[0033] According to the above chemical composition ratio, with CaCO 3 、Al 2 o 3 , SiO 2 , ZnO, H 3 BO 3 After weighing the raw materials, in a polytetrafluoroethylene ball mill tank, according to the mass ratio of raw materials: grinding balls: deionized water = 1:2:1, wet ball milling at a speed of 300r / min for 5 hours to obtain a mixed material;

[0034] (2) Melting and quenching

[0035] The above mixed material was dried at 100°C for 10 hours, ground and passed through a 200-mesh sieve, then melted at 1450°C for 1 hour, and then poured the melted ...

Embodiment 2

[0044] This embodiment differs from Embodiment 1 in that:

[0045] The chemical composition of glass-ceramic solder is CaO 10wt%, Al 2 o 3 20 wt%, SiO 2 55wt%, ZnO10wt%, B 2 o 3 5 wt%; the thermal expansion coefficient of the glass-ceramic solder between 25 and 700°C is 6.5×10 -6 / °C.

[0046] The room temperature strength of the alumina joints connected by glass-ceramics prepared in this example reaches 280 MPa, which is 30% higher than that of common glass joints.

Embodiment 3

[0048] This embodiment differs from Embodiment 1 in that:

[0049] In the method for connecting alumina ceramics with the glass-ceramic solder of this embodiment, the welding treatment system of step (3) in the brazing furnace is as follows: heating from room temperature to 350° C. at a rate of 10° C. / min, keeping the temperature for 60 minutes, and then heating for 5° C. Continue to heat to 1200°C at a rate of ℃ / min, and after holding for 40 minutes, cool to 860°C at a rate of 20°C / min, and hold for 1 hour.

[0050] The room temperature strength of the alumina joints connected by glass-ceramics prepared in this example reaches 274 MPa, which is 27.5% higher than that of ordinary glass joints.

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Abstract

The invention discloses a microcrystalline glass solder. The microcrystalline glass solder comprises the following chemical components in percentage by weight: 15 to 20 percent of CaO, 10 to 25 percent of Al2O3, 50 to 55 percent of SiO2, 5 to 10 percent of ZnO and 5 to 10 percent of B2O3. The glass thermal expansion coefficient of the microcrystalline glass solder at 25-700 DEG C is 5.9 * 10<-6> / DEG C-6.5 * 10<-6> / DEG C. In addition, the invention further discloses a preparation method of the microcrystalline glass solder and a method for connecting aluminum oxide ceramics. The thermal expansion coefficient of the microcrystalline glass solder is matched with the thermal expansion of an aluminum oxide ceramic base material; and the microcrystalline glass solder has a proper connection temperature, so low-temperature aluminum oxide ceramic connection is realized, the technological difficulty of aluminum oxide ceramic connection is reduced, the room-temperature strength of a joint is improved, defects such as pores and cracks are avoided, and the connection quality of aluminum oxide ceramic is effectively improved.

Description

technical field [0001] The invention relates to the technical field of alumina ceramic connection, in particular to a glass-ceramic solder, a preparation method thereof and a method for connecting alumina ceramics. Background technique [0002] Alumina ceramics have the advantages of high mechanical strength, small dielectric loss, high insulation resistance, high hardness, wear resistance, corrosion resistance, high temperature resistance, etc., and are widely used in various fields such as aviation, military, machinery, petroleum, chemical industry and electronics. However, due to the inherent brittleness of ceramic materials and the difficulty in machining, it is difficult to prepare alumina ceramics into components with large sizes and complex shapes, so its application range is greatly limited. In order to construct alumina ceramic components with complex shapes and large sizes, connection technology is required. Combining simple structural components into components wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C10/04C03C10/14C03C8/24C04B37/00
CPCC03C10/0009C03C8/24C04B37/003C04B2237/10C04B2237/52
Inventor 李恺万德田李月明刘亚楠郑伟俊周洁周玉丹苏雅琴
Owner JINGDEZHEN CERAMIC INSTITUTE
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