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Printed circuit board with embedded micro-channels and preparation method of printed circuit board

A printed circuit board, micro-channel technology, applied in printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of limited heat dissipation capacity, low heat flow density heat dissipation, etc., to achieve enhanced heat dissipation effect, high heat flow density heat dissipation, Achieve the effect of high-density transmission

Active Publication Date: 2021-06-29
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this printed circuit board based on passive heat dissipation has limited heat dissipation capacity and can only solve the heat dissipation problem of low heat flux
[0004] How to combine micro-channel heat dissipation technology with printed circuit board high-density integration technology to achieve high heat flux heat dissipation is still rarely reported

Method used

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  • Printed circuit board with embedded micro-channels and preparation method of printed circuit board
  • Printed circuit board with embedded micro-channels and preparation method of printed circuit board
  • Printed circuit board with embedded micro-channels and preparation method of printed circuit board

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Embodiment Construction

[0044] The present invention will be further described below with reference to the accompanying drawings and embodiments, and the mode of the present invention includes but not limited to the following embodiments.

[0045] The present invention combines micro-channel heat dissipation technology with printed circuit board high-density integration technology to achieve high heat flux heat dissipation. The specific structure of the prepared printed circuit board is as follows:

[0046] A printed circuit board with embedded microfluidics, such as Figure 1-5 As shown, the printed circuit board 7 includes an embedded micro-channel metal core board 1, and the top of the embedded micro-channel metal core board 1 is provided with an n-layer wiring layer-3, and the embedded micro-channel metal core board 1 The bottom of the core board 1 is provided with an m-layer wiring layer 2 6, and the printed circuit board 7 is provided with a liquid inlet 8 and a liquid outlet 8 connected to the...

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PUM

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Abstract

The invention discloses a printed circuit board with embedded micro-channels. The printed circuit board comprises an embedded micro-channel metal core plate, wherein the top part of the embedded micro-channel metal core plate is provided with n wiring layers I, the bottom part of the embedded micro-channel metal core plate is provided with m wiring layers II, and the printed circuit board is provided with a liquid inlet and a liquid outlet which are communicated with the micro-channel. The structure has efficient heat dissipation capability, can realize transmission of high-density electrical signals, and meets the application requirements of high-density integrated high-power electronic devices.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of microelectronics, in particular to a printed circuit board embedded with micro-flow channels and a preparation method thereof. Background technique [0002] With the further improvement of the integration density of electronic systems and the gradual increase of power density, thermal management has gradually become one of the technical bottlenecks in the development of electronic systems. Traditional passive heat dissipation technology can no longer meet the heat dissipation requirements of high-power devices. This is because: traditional passive heat dissipation uses a metal heat sink, which dissipates heat through metal heat conduction and heat radiation, which is not suitable for heat transfer with large heat flux density. The use of microfluidics to achieve enhanced thermal management technology for heat dissipation has become an important solution. Compared with passive heat di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/00
CPCH05K1/0203H05K3/0061H05K1/111H05K2201/064
Inventor 徐诺心张剑曾策边方胜程圣常义宽徐榕青谢国平刘军苟中月
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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