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Printed circuit board with embedded array micro-channels and preparation method of printed circuit board

A technology of printed circuit boards and micro-channels, which is applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc., to achieve the effect of increasing integration density and realizing arrayed high-density transmission.

Active Publication Date: 2021-08-13
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, for the array integrated system, how to rationally arrange the arrayed high-efficiency array heat dissipation microchannels and shunt networks to achieve high heat and flow sharing; how to combine the array microchannel heat dissipation technology with the high-density integration technology of printed circuit boards In combination, while realizing arrayed high heat flux heat dissipation, it also meets the high-density integration requirements of low-profile arrays, and there are few reports so far.

Method used

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  • Printed circuit board with embedded array micro-channels and preparation method of printed circuit board
  • Printed circuit board with embedded array micro-channels and preparation method of printed circuit board
  • Printed circuit board with embedded array micro-channels and preparation method of printed circuit board

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Embodiment 1

[0042] as attached figure 1 As shown, it is a schematic cross-sectional view of a printed circuit board embedded with array micro-channels provided in this embodiment. The printed circuit board embedded with micro-channels specifically includes a metal core board 1, and the upper surface of the metal core board 1 is The top multi-layer wiring layer 6 is provided, and the bottom multi-layer wiring layer 9 is provided on the lower surface. The metal core board 1 is embedded with an array of heat-dissipating micro-channels 2 connected to the liquid inlet and outlet 5 .

[0043] as attached Figure 4 , 5 Shown is the top multilayer wiring layer 6 and the bottom multilayer wiring layer 9 of the metal core board 1 provided in this embodiment, and the top multilayer wiring layer 6 and the bottom multilayer wiring layer 9 are respectively provided with organic wiring layers distributed at intervals 7 and copper wiring layer 8 to realize a multilayer circuit.

[0044] Wherein, the a...

Embodiment 2

[0052] as attached Figure 7 Shown is a method for preparing a printed circuit board with an embedded array of microfluidic channels provided in this embodiment. The method specifically includes the following steps:

[0053] Step 1: Provide a flat and smooth copper core board.

[0054] Step 2: Preparing an arrayed high-efficiency array heat-dissipating microfluidic channel unit and a shunt network on the copper core board by precision machining.

[0055] Step 3: Weld the copper core board prepared with the arrayed high-efficiency array heat dissipation microchannel unit and the shunt network with another copper core board by vacuum diffusion welding to obtain a copper core board with embedded array microchannels.

[0056] Step 4: Provide the multi-layer wiring layer on top of the metal core board prepared by the printed circuit board lamination process.

[0057] Step five: providing a multilayer wiring layer at the bottom of the metal core board prepared by a printed circuit...

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Abstract

The invention discloses a printed circuit board with embedded array micro-channels and a preparation method of the printed circuit board. The printed circuit board comprises a metal core plate (1), wherein the upper surface of the metal core plate (1) is provided with a top multi-layer wiring layer (6), the lower surface of the metal core plate (1) is provided with a bottom multi-layer wiring layer (9), the metal core plate (1) is internally embedded with array heat dissipation micro-channels (2), and the array heat dissipation micro-channels (2) are connected with a liquid inlet / outlet (5). According to the invention, the metal core plate embedded with the micro-channels is integrated in the printed circuit board, so high-heat-flux heat dissipation is realized, and the requirements of a low-profile array for high-efficiency heat dissipation and high-density integration are met.

Description

technical field [0001] The invention belongs to the technical field of microelectronic heat dissipation, and in particular relates to a printed circuit board embedded with an array of micro-flow channels and a preparation method thereof. Background technique [0002] With the further improvement of the electronic system's requirements for low cost, miniaturization, and multi-function, the radio frequency aperture is developing in the direction of high-density, low-profile integration. The existing traditional array integration method based on brick-type transceiver components has gradually been unable to meet the stringent requirements of electronic systems. It is urgent to carry out research on a new generation of low-profile array integration technology based on tile-type transceiver components to integrate the arrayed RF transceiver channels as a whole. On a complete printed circuit board, further reducing system weight. [0003] However, traditional printed circuit boar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0201H05K3/00
Inventor 张剑徐诺心曾策卢茜边方胜向伟玮赵明叶惠婕董乐李杨
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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