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Composite polyimide film and preparation method thereof

A technology for compounding polyimide and polyimide film, which is applied in the field of thermally conductive materials, can solve the problems of uneven shrinkage, appearance wrinkles and cracks of polyimide film, and achieve the effect of avoiding uneven shrinkage and promoting discharge.

Active Publication Date: 2021-06-29
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the application provides a composite polyimide film and its preparation method, which are used to solve the problems of uneven shrinkage, wrinkled appearance and cracking in the carbonization process of the existing polyimide film

Method used

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  • Composite polyimide film and preparation method thereof
  • Composite polyimide film and preparation method thereof
  • Composite polyimide film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0049] Add 1g of nickel metal powder with a particle size of 200nm to 20ml of ethanol solution, heat to 40°C, and further purify the powder. After 1h, filter the powder and dry it, then add the treated powder to 40ml of N,N-dimethyl Diethyl acetamide (DMAc) solution, placed in an ultrasonic machine ultrasonic treatment 2h so that it can be uniformly dispersed.

[0050] Bake the 500ml three-neck flask equipped with mercury seal, nitrogen gas inlet tube, drying tube and bottle stopper with flame to remove trace moisture, and put it into a constant temperature water bath after cooling under nitrogen flow, and adjust the temperature to -10°C. Add the ultrasonicated nickel solution into the three-necked flask, and put the stirring bar of the mechanical stirrer into the bottle to start stirring.

[0051] Add 10 g of 4,4'-diaminodiphenyl ether (ODA) into the nickel-containing DMAc solution, and then add 60 ml of DMAc to it, and continue stirring for 1 h in an ice-water bath at -10°C ...

Embodiment 2

[0058] Add 0.5 g of nickel metal powder with a particle size of 50 nm into 30 ml of methanol solution, heat to 40 ° C, and further purify the powder. After 30 min, filter the powder and dry it, then add the treated powder to 20 ml of N-methylpyrrolidone ( NMP) solution, placed in an ultrasonic machine for ultrasonic treatment for 1 h so that it can be uniformly dispersed.

[0059] Bake the 500ml three-neck flask equipped with mercury seal, nitrogen gas inlet tube, drying tube and bottle stopper with flame to remove trace moisture, and put it into a constant temperature water bath after cooling under nitrogen flow, and adjust the temperature to -5 °C. Add the ultrasonicated nickel solution into the three-necked flask, and put the stirring bar of the mechanical stirrer into the bottle to start stirring.

[0060] Add 5 g of 4,4'-diaminodiphenyl ether (ODA) into the nickel-containing DMAc solution, and add 20 ml of DMAc to it, and continue stirring for 1 h under the condition of -...

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Abstract

The invention belongs to the technical field of heat conduction materials, and particularly relates to a composite polyimide film and a preparation method thereof. The invention provides a preparation method of a composite polyimide film, which comprises the following steps: preparing a nickel-polyamic acid mixed solution, and blade-coating the de-foamed nickel-polyamic acid mixed solution on a glass plate for imidization reaction to prepare the composite polyimide film. The preparation method is used for solving the technical problems of non-uniform shrinkage, appearance wrinkling and cracking of an existing polyimide film in the high-temperature carbonization process.

Description

technical field [0001] The application belongs to the technical field of heat-conducting materials, and in particular relates to a composite polyimide film and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of the electronics industry, portable smart communication devices such as mobile phones and tablet computers have higher and higher requirements for heat dissipation, and the demand for compressible and bendable artificial graphite sheets with high thermal conductivity is increasing. Polyimide film has a rigid aromatic ring structure, which makes it have a small linear expansion coefficient and good dimensional stability, and is the preferred raw material for the preparation of artificial graphite sheets; [0003] However, when the artificial graphite film is prepared at high temperature, the polyimide film is prone to problems such as uneven shrinkage, wrinkled appearance, and even cracking during the conversion in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K3/08C08J5/18
CPCC08J5/18C08J2379/08C08K2003/0862C08K2201/011
Inventor 王启民蔡云飞张腾飞
Owner GUANGDONG UNIV OF TECH
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