Superfine active silica powder applied to electronic industry and preparation method thereof

Abstract

The invention provides superfine active silica powder applied to the electronic industry and a preparation method thereof, and the preparation method comprises the following steps: crushing and grading raw material quartz sand to obtain unmodified primary silica powder; adding purified water into the unmodified primary silica powder to prepare slurry; heating the slurry to 110-140 DEG C, and then adding a mixture of a modifier and an activating agent to carry out primary modification reaction; after the primary modification reaction is carried out for 5-8 minutes, adding the mixture of the modifier and the activating agent again, continuously keeping the temperature at 110-140 DEG C, and carrying out secondary modification reaction to obtain a modified material; and drying the modified material to prepare a filter cake, and crushing and grading to obtain the superfine active silica powder. According to the preparation method disclosed by the invention, a twice crushing and grading process and a wet modification process are adopted, so that the prepared superfine active silica powder has the characteristics of being easy to combine with epoxy resin, narrow and uniform in particle size distribution, good in coating effect, low in water content and the like required by the electronic industry, and can be widely applied to various electronic industries as a functional inorganic filler.

Description

technical field [0001] The invention relates to the technical field of deep processing of inorganic non-metallic mineral products, in particular to an ultrafine active silicon micropowder used in the electronics industry and a preparation method thereof. Background technique [0002] Silica powder is a very important inorganic non-metallic functional filler, which is widely used in electrical and electronics, silicone rubber, coatings, adhesives, potting materials and other fields. With the technological development of 5G, big data and artificial intelligence in recent years , Silicon micropowder technology used in the electronics industry has advanced by leaps and bounds. However, since silicon micropowder is an inorganic substance, it must be combined with epoxy resin in the application of the electronics industry, which causes the problem of poor compatibility between organic and inorganic combinations. This is determined by the basic characteristics of organic and inorga...

AI Technical Summary

Problems solved by technology

However, since microsilica powder is an inorganic substance, it must be combined with epoxy resin in the application of the electronics industry, which causes the problem of poor compatibility between organic and inorganic combinations. This is determined by the basic characteristics of organic and inorganic substances. For this reason, when microsilica powder is used as a filler in the electronics industry, it is difficult to disperse evenly in the resin system, and it is also difficult to form a strong bonding force with the matrix material, which reduces some properties of the matrix.

Among the existing modification technologies, dry modification is mostly used, and the powder coating effect of this method is poor, and the particle size of the powder will increase after modification

[0003] In the prior art, the unmodified microsilica powder has poor compatibility with the resin system, so the modification process is adopted. At the same time, the uneven particle size distribution is likely to cause adverse phenomena such as "fish eyes" and glue flow of the matrix material, so two methods are adopted. Secondary crushing and grading process to achieve control of large particles and make particle size distribution more reasonable. Therefore, in the existing technology, is it appropriate to add the entire manuscript?

As follows: In the prior art, microsilica powder has many problems when it is applied to the electronics industry: first, it has poor compatibility with the resin system; To meet the requirement that the size of the filler in the electronics industry should be lower than 50% of the thickness of the sheet as much as possible; the third is that the particle size distribution is uneven and wide, which is easy to cause the flow of the sheet and the bad phenomenon of "fish eyes"; the fourth is the existing modification In the technology, more dry modification is used, the powder coating effect of this method is poor, and the particle size of the powder will increase after modification