Eutectic device and transistor package eutectic system

Abstract

The invention provides a eutectic device and a transistor packaging eutectic system. The eutectic device includes a wafer suction structure, a product suction structure to be eutectic, a preheating structure, a eutectic heating platform, and a eutectic identification structure. The structure is used to pick up the wafer and the product to be eutectic. The suction structure is used to pick up the product to be eutectic. The preheating structure is used to preheat the product to be eutectic. The identification structure is used to take pictures during the eutectic process. There are two preheating structures, eutectic heating platforms and eutectic identification structures. The two preheating structures are respectively set corresponding to the two eutectic heating platforms. The eutectic recognition structure is correspondingly arranged above the two eutectic heating platforms. The eutectic device can improve eutectic efficiency, and the two preheating structures have the same structure, which greatly reduces the influence of preheating structure processing and assembly tolerances, making the eutectic precision of the two eutectic heating platforms basically consistent with the eutectic effect.

Description

technical field [0001] The invention belongs to the technical field of transistor packaging, and more specifically relates to a eutectic device and a transistor packaging eutectic system. Background technique [0002] The TO-CAN eutectic system currently used in the optical communication industry uses a heating platform, and the same preheating system is equipped with two or four preheating rotating tubes. Due to the large processing and assembly tolerances of each preheating rotary tube, the eutectic precision and eutectic welding effect between the preheating tubes will be greatly different, which will increase the difficulty of subsequent processes and affect product performance. [0003] The four preheating tubes of the existing TO-CAN eutectic system are distributed on the same rotating system at intervals of 90°, and are assembled on the rotating system by sinking the preheating tubes and fixing the top wire on the side. The suction nozzle puts the product into 1 # T...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiments of the present invention is to provide a eutectic device to solve the technical problems of transistor eutectic accuracy and poor welding effect in the prior art

[0005] Another purpose of the embodiments of the present invention is to provide a transistor packaging eutectic system to solve the technical problems of transistor eutectic accuracy and poor welding effect existing in the prior art

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