Knitted fiber sorting process and auxiliary fixture

Abstract

The present application relates to a knitted fiber sorting process and an auxiliary jig, which includes the following steps: S1, installing two layers of carriers on the auxiliary jig in parallel; S2, placing the auxiliary jig on the sewing equipment, and aligning the needles vertically Carrier; S3. The sewing equipment knits the full carrier vertically back and forth between the two layers of carriers; S4. Put the full carrier and auxiliary fixture into the container, pour the liquid colloid to heat and solidify; S5. Place the carrier along the edge of the effective part Cut out the prefabricated product; S6, cut the prefabricated product into a plurality of semi-finished products; S7, grind both sides of the semi-finished product to obtain the finished product. The fiber filaments in the finished thermal pad are parallel to each other in the thickness direction of the finished product and perpendicular to the horizontal direction, which greatly improves the use efficiency of the fiber filaments. At the same time, the two use surfaces of the finished thermal pad are directly connected through the fiber filaments. It has the effect of improving the thermal conductivity of the thermally conductive gasket.

Description

technical field [0001] The application relates to the field of thermally conductive gaskets, and in particular, to a knitted fiber sorting process and an auxiliary fixture. Background technique [0002] With the rapid development of the network, various electronic products are developing in the direction of miniaturization, refinement and high power, and the integration density of transistors has greatly increased. The substantial increase in electronic integration means that the electronic components encapsulated in the circuit board will generate more heat. If the heat is not conducted out in time, it will cause the rapid accumulation of heat in the electronic products, which will increase the operating temperature of the electronic components. high, affecting the normal operation of the device. [0003] At present, thermally conductive gaskets are usually used to quickly transfer heat to the heat sink, and thermally conductive gaskets usually improve thermal conductivity...

AI Technical Summary

Problems solved by technology

[0004] Regarding the above-mentioned related technologies, there are the following defects: the carbon fiber orientation degree of the thermal pad produced in the current way is relatively low, so that the defect that the carbon fiber filling can still be formed and the thermal conductivity cannot be increased

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