High-performance large-area flexible transparent electrode, preparation method and application thereof

Abstract

The invention relates to a high-performance large-area flexible transparent electrode, a preparation method and application thereof. The method comprises the following specific steps of: 1) printing a metal patterned structure on a printing substrate in a micro-nano 3D multi-layer printing manner by using an electric field driven jet micro-nano 3D printing technology and taking metal nano slurry as a printing material, and then curing and sintering the metal patterned structure; 2) conducting transfer printing of a PDMS female die; (3) conducting transfer printing of a UV photoresist male die; (4) preparing a composite soft mold; and 5) preparing an embedded flexible transparent conductive film. The manufacturing of a microstructure with a diameter size of 10-15 microns and a height-width ratio of 0.5-4.0 is realized, and a transparent electrode structure with high light transmittance and low square resistance can be manufactured.

Description

technical field [0001] The invention belongs to the technical field of transparent electrode manufacturing, and in particular relates to a high-performance large-area flexible transparent electrode and its preparation method and application. Background technique [0002] The information disclosed in this background section is only intended to increase the understanding of the general background of the present invention, and is not necessarily taken as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. [0003] Transparent electrodes are one of the optoelectronic devices that can conduct electricity and have high light transmittance in the visible range. Devices, flexible thin-film solar cells, electromagnetic interference shielding windows, electronic paper and transparent electric heating and many other fields have a wide range of applications. [0004] Nowadays, the development of electroni...

AI Technical Summary

Problems solved by technology

Although the method of combining nanoimprinting and scraping coating can realize the manufacture of flexible transparent conductive film embedded in metal mesh, which has the advantages of high efficiency and good consistency, but the equipment is expensive and the requirements for nano conductive ink are strict (metal content, surface Tension, sintering temperature, etc.), and it is difficult to realize the manufacture of large-width metal grid structures (difficult to fill conductive ink, difficult to release molds when imprinting large-area and large-width-ratio structures, and easy to cause damage to molds and embossed features)

Micro-transfer printing (positive transfer printing, negative transfer printing, printing transfer printing) method, although the process is simple and easy to operate, but the transfer printing materials are limited, especially the printing transfer printing technology, which needs multiple transfer printing, transfer printing The efficiency is relatively low, and inkjet printing and electrospray printing are difficult to print high metal content and large aspect ratio microstructures

In summary, high-performance embedded metal mesh (large aspect ratio, high resolution, high light transmittance, low square resistance) low-cost, mass-scale manufacturing technology is still difficult to achieve

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