Circuit board electroplating equipment

Abstract

The invention discloses circuit board electroplating equipment, relates to the technical field of circuit board processing, and solves the problems that circuit boards need to be fixed on the electroplating equipment when existing circuit board electroplating equipment is used, the circuit boards of the existing electroplating equipment need to be fixed through clamps, the positions of the existing clamps are generally fixed, when the sizes of circuit boards are different, the distance between the clamps is difficult to adjust, so that fixation is poor, meanwhile, when the circuit boards are fixed, the clamps need to be operated as much as possible one by one, operation is troublesome, and the production efficiency. Four pairs of adjusting connecting rods are arranged at the bottom of an upper mounting seat; and the bottoms of the four pairs of adjusting connecting rods are jointly connected with a group of lower mounting seats. The circuit board electroplating equipment has good adjusting capacity and higher adaptability, the clamping effect of a circuit board is better, meanwhile, synchronous pressing of five sets of active clamping blocks can be achieved by rotating clamping operation pieces, operation is reduced, and working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board electroplating equipment. Background technique [0002] An important step in the process of circuit board production is electroplating. The principle of electroplating is to electroplate a layer of metal or form an alloy on the surface of other metals. It mainly uses the effect of electrolysis to form the same oxidized metal film on the metal surface or non-metal surface, so as to prevent oxidation, reflect light, and resist corrosion (copper sulfate, etc.). [0003] For example, the application number: CN200910310544.7 The present invention provides an ultra-thin magnetic-fixed printed circuit board electroplating fixture, which is used to clamp the printed circuit board. The printed circuit board electroplating includes a first clamping portion, the first clamping portion includes a main body and a clamping cover, the main body includes a firs...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of circuit board electroplating equipment, to solve the problem that the existing circuit board electroplating equipment proposed in the above background technology needs to fix the circuit board on the electroplating equipment when in use, the fixing of the existing electroplating equipment circuit board When fixing the circuit board, it needs to be fixed by the fixture. The position of the existing fixture is generally fixed. When the size of the circuit board is different, the distance between the fixtures is difficult to adjust, resulting in poor fixation. Troublesome operation, problems that affect production efficiency

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