Intelligent laser spot welding equipment for chip processing and chip processing technology

Abstract

The invention relates to the technical field of chip welding, and discloses intelligent laser spot welding equipment for chip machining and a chip machining technology. The intelligent laser spot welding equipment comprises a spot welding platform, a laser transmitter is fixedly connected to the top of the rear end of the spot welding platform, a first lens is fixedly connected to one side of the laser transmitter, fixing frames are arranged on the two sides of the spot welding platform, the front side and the rear side of the fixing frames are rotationally connected with first synchronous wheels, the first synchronous wheels are sleeved with first synchronous belts, and the top of the fixing frames are fixedly connected with guide rods. According to the equipment, an X-direction servo motor drives a second synchronous wheel to rotate, the second synchronous wheel drives a headstock to move through a second synchronous belt, a Y-direction servo motor drives the first synchronous wheel to rotate, the first synchronous wheel drives a cross beam to move through the first synchronous belt, so that movement and welding operation of a focus lens in a plane are effectively achieved, under the positioning of a CCD camera, the welding position of the chip can be effectively positioned and spot welding can be completed, so that time and labor are prevented from being wasted during operation of personnel, and the production efficiency is effectively improved.

Description

technical field [0001] The invention relates to the technical field of chip welding, in particular to an intelligent laser spot welding device for chip processing and a chip processing technology. Background technique [0002] Chip, also known as microcircuit, microchip, integrated circuit. It refers to a silicon chip containing an integrated circuit, which is small in size and is often a part of a computer or other electronic equipment. In electronics, a chip is a way to miniaturize circuits and is usually manufactured on the surface of a semiconductor wafer. The aforementioned integrated circuits that manufacture circuits on the surface of semiconductor chips are also called thin film integrated circuits. Another kind of thick-film hybrid integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into a substrate or circuit board. [0003] At present, the soldering of chips is mostly through artificial sol...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an intelligent laser spot welding equipment for chip processing, which has the advantages of simple operation and high efficiency, and solves the problems of difficult chip welding and low efficiency

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