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Semiconductor lead frame stacking device

A lead frame and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, transportation and packaging, electrical components, etc., can solve the problems of low production efficiency and manpower consumption, and achieve the effects of reducing production costs, saving labor, and avoiding artificial addition

Active Publication Date: 2021-05-14
四川旭茂微科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most semiconductors use two lead frame models to overlap to form a package structure. Most of the existing lead frame stacking devices use an assembly line structure, using pads to transfer the bottom lead frame along the conveying line, then bonding the chip, and then stacking The top-level lead frame, this method needs to be manually put into the pads equipped with lead frames one by one, and then the stacked lead frames and pads are taken out one by one, the production efficiency is low, and it is very labor-intensive

Method used

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  • Semiconductor lead frame stacking device
  • Semiconductor lead frame stacking device
  • Semiconductor lead frame stacking device

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Embodiment

[0048] Such as Figure 1 to Figure 7 As shown, a semiconductor lead frame stacking device includes: a first linear mechanism 100, a stacking mechanism 200, a pad buffer mechanism 300, a second linear mechanism 400, a third linear mechanism 500, a rotating mechanism 600 and a first Four linear mechanism 700.

[0049] Specifically, the first linear mechanism 100 has a stacking mechanism 200 at one end and a pad buffer mechanism 300 at the other end for stacking empty pads. One end of the stacking mechanism 200 is sequentially provided with a pad mounting station 110, a first assembly station 120, a second assembly station 130, and a finished product stacking station 140, and the stacking mechanism 200 is arranged above the finished product stacking station 140. The linear mechanism 100 is slidably provided with a running plate 150. The running plate 150 is used to install and transfer the pad 10. The top surface of the pad 10 is used to carry the bottom lead frame, correspondin...

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Abstract

The invention provides a semiconductor lead frame stacking device, which comprises: a first linear mechanism, which is provided with a stacking mechanism at one end and a bonding pad caching mechanism at the other end, and is provided with a bonding pad mounting station, a first assembling station, a second assembling station and a finished product stacking station, and is slidably equipped with a transfer plate; the stacking mechanism, which is provided with four groups of rotating stop blocks for supporting bonding pads, and is also provided with a pair of lifting plates; a second linear mechanism, which is provided with a first discharging station corresponding to the first assembling station and is provided with a second discharging station corresponding to the second assembling station; a third linear mechanism, which is provided with a bottom frame suction disc and is used for transferring a bottom lead frame; a rotating mechanism, which is provided with a rotating suction disc for bearing a top lead frame; and a fourth linear mechanism, which is provided with a top frame suction disc for transferring the top lead frame from the second discharging station to the rotating suction disc and enabling the top lead frame to coincide with the bottom lead frame. Manpower is saved, and production efficiency is improved.

Description

technical field [0001] The invention belongs to the field of semiconductor lead frame assembly, in particular to a semiconductor lead frame stacking device. Background technique [0002] Most semiconductors use two lead frame models to overlap to form a package structure. Most of the existing lead frame stacking devices use an assembly line structure, using pads to transfer the bottom lead frame along the conveying line, then bonding the chip, and then stacking The top-layer lead frame, this method needs to be manually put into the pads with the lead frame one by one, and then the stacked lead frames and pads are taken out one by one, the production efficiency is low, and it is very labor-intensive. Contents of the invention [0003] In order to solve the deficiencies in the prior art, the present invention provides a stacking device for semiconductor lead frames. The pad buffer mechanism can place multiple empty pads at one time, avoiding placing one by one. The bottom le...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/683H01L21/687H01L21/67
CPCH01L21/67144H01L21/67742H01L21/67766H01L21/6838H01L21/68792
Inventor 王秋明贺国东赵文全温正萍邹佩纯赵雪
Owner 四川旭茂微科技有限公司
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